Segmented Display Connection Pads for Reliable Bump Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display devices face challenges in achieving reliable electrical connections between electronic components and display panels, particularly due to limitations in conductivity and processing efficiency in ultrasonography bonding methods.
Innovation Solution
The display device incorporates a design with a display substrate featuring signal pads and connection pads, where the connection pads include alternating portions for contact with bumps, and a filler is used between the electronic component and the connection pads, which is cured during the ultrasonography bonding process to enhance electrical contact and reduce processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ultrasonography bonding is used to connect the electronic component and display panel, then conductivity increases, but processing time is extended due to oxidation prevention requirements
Solution Approach 1:
The patent applies preliminary action by pre-filling the gap between the electronic component and connection pad with filler material before ultrasonography bonding. This preliminary filling prevents oxidation during the bonding process, eliminating the need for separate oxidation prevention steps and reducing overall processing time while maintaining connection reliability.
Solution Approach 2:
The filler material serves as an intermediary substance between the electronic component and connection pad. It mediates the bonding process by preventing oxidation and facilitating reliable electrical connection, thus improving connection reliability without extending processing time.
2Device complexity
If the connection pad part uses a simple structure, then device complexity is reduced, but electrical connection characteristics deteriorate
Solution Approach 1:
The connection pad part is segmented into multiple portions (first connection pad part and second connection pad part) with different functions. The first portion provides electrical connection while the second portion provides mechanical support and gap filling, allowing the structure to achieve reliable electrical connection characteristics without excessive overall complexity.
Solution Approach 2:
Different portions of the connection pad part have different local qualities - the first connection pad part has conductive properties for electrical connection, while the second connection pad part has structural properties for support. This local differentiation allows the structure to achieve reliable electrical connection characteristics without requiring the entire structure to be complex.
3Ease of manufacture
If the first connection pad part has continuous structure, then manufacturing is simplified, but contact reliability with bumps deteriorates
Solution Approach 1:
The first connection pad part is segmented into multiple discrete portions arranged in an array, each portion independently contacting bumps. This segmentation improves bump contact reliability by ensuring each bump has its own dedicated contact area, while the regular array pattern keeps manufacturing relatively simple through repetitive patterning processes.
Solution Approach 2:
Instead of providing a single continuous connection area, the patent provides multiple discrete connection portions - an excessive number of contact points compared to a single continuous pad. This partial distribution of contact areas improves reliability by ensuring that if one contact point fails, others remain functional, while still maintaining ease of manufacture through standardized repetitive structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the electrical connection characteristics between the electronic component and the display panel, while also shortening the overall processing time by ensuring reliable bonding and preventing oxidation through the use of a filler that changes viscosity with temperature.
Implementation Method 1
a filler is used between the electronic component and the connection pads, which is cured during the ultrasonography bonding process to enhance electrical contact and reduce processing time
Implementation Method 2
in the connection method between the display panel and the electronic component using the ultrasonography bonding
Data Source
AI summary
A display device includes a display substrate, a signal pad part, an insulating layer, a connection pad part, and an electronic component. The signal pad part includes first and second signal pad parts, which face each other in one direction. The insulating layer covers the signal pad part. The connection pad part is disposed on the insulating layer and includes a first connection pad part overlapping the first signal pad part and a second connection pad part. The second connection pad part is electrically connected to the first connection pad part and is in electrical contact with the second signal pad part through a contact hole defined in the insulating layer. The electronic component includes a bump that is in electrical contact with the first connection pad part. The first signal pad part includes a plurality of signal pad portions spaced apart from each other.