Segmented Pad Configuration for Signal Routing in Electronic Packages
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Solution Overview
Problem
The shrinking dimensions of integrated circuit dies pose challenges for conventional pad structures and configurations in electronic package assemblies, which struggle to effectively route electrical signals to or from semiconductor dies.
Innovation Solution
The electronic package assembly incorporates a solder mask layer with openings and a plurality of pads, each having a terminal portion for receiving package interconnect structures and an extended portion for receiving electrical connections from the die, allowing for efficient signal routing between the die and external devices, including printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional pad structures are used with shrinking die dimensions, then manufacturing simplicity is maintained, but signal routing effectiveness deteriorates
Solution Approach 1:
The pad structure is segmented into multiple functional portions: a terminal portion for receiving package interconnect structures and an extended portion for receiving electrical connections from the die. This segmentation allows each portion to be optimized for its specific function, improving signal routing effectiveness while maintaining manufacturing feasibility through standardized fabrication processes.
Solution Approach 2:
The pad structure extends in multiple dimensions beyond simple planar configurations. The extended portion projects from the terminal portion, creating a three-dimensional arrangement that enables effective signal routing in limited spaces, accommodating shrinking die dimensions while maintaining routing effectiveness.
2Productivity
If die dimensions are reduced to continue scaling, then integration density is improved, but pad routing capability deteriorates
Solution Approach 1:
Different portions of the pad structure have different geometries and functions optimized for local requirements. The terminal portion is configured for receiving package interconnect structures while the extended portion is configured for die electrical connections, allowing each region to be locally optimized for its specific routing function despite overall die size reduction.
Solution Approach 2:
The pad structure serves multiple functions within a single integrated component: it provides mechanical support, electrical connection, and signal routing. The multi-functional design allows the same structure to accommodate various die sizes and configurations, maintaining routing capability across different integration density requirements.
3Ease of manufacture
If pad configurations are simplified for manufacturing, then ease of manufacture is improved, but adaptability to different applications deteriorates
Solution Approach 1:
The pad structure allows for parameter variations such as different sizes, shapes, and configurations of the terminal and extended portions. These parameter changes enable adaptation to different applications and die configurations while maintaining the same fundamental fabrication process, thus preserving ease of manufacture across diverse applications.
Solution Approach 2:
The universal pad design can be applied across multiple applications and die types by adjusting geometric parameters rather than redesigning the entire structure. This multi-functionality allows a single manufacturing process to produce pads suited for various signal routing requirements, maintaining ease of manufacture while achieving application versatility.
Data Source
AI summary
Embodiments of the present disclosure provide an electronic package assembly comprising a solder mask layer, the solder mask layer having at least one opening, and a plurality of pads coupled to the solder mask layer, wherein at least one pad of the plurality of pads includes (i) a first side, (ii) a second side, the first side being disposed opposite to the second side, (iii) a terminal portion and (iv) an extended portion, wherein the first side at the terminal portion is configured to receive a package interconnect structure through the at least one opening in the solder mask layer, the package interconnect structure to route electrical signals between a die and another electronic device that is external to the electronic package assembly, and wherein the second side at the extended portion is configured to receive one or more electrical connections from the die.