Segmented Conductive Pad Layout for Wafer-Level IC Packaging
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Solution Overview
Problem
Existing semiconductor device manufacturing processes face challenges in efficiently integrating conductive pads and conductive wirings, particularly in terms of layout and electrical testing, which affect the reliability and cost of integrated circuit components.
Innovation Solution
A novel manufacturing method for integrated circuit components involves forming conductive pads with distinct regions for core contact, buffer contact, and testing, along with a seed layer and conductive pillars, followed by flip-chip bonding and wafer-level packaging to enhance electrical connectivity and reduce manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional manufacturing processes are used for integrating conductive pads and conductive wirings, then the manufacturing process is simpler, but the electrical testing reliability and connectivity are insufficient
Solution Approach 1:
The conductive pad is divided into multiple distinct regions including a core contact region, a buffer contact region, and a testing region. This segmentation allows each region to serve its specific function independently, improving electrical testing reliability by providing dedicated areas for different electrical operations while maintaining a structured layout that manages complexity.
Solution Approach 2:
Different regions of the conductive pad are assigned different functional qualities: the core contact region for primary electrical connection, the buffer contact region for signal buffering, and the testing region for electrical testing. This local differentiation of properties enhances overall reliability by optimizing each area for its specific purpose without requiring complete redesign of the entire pad structure.
2Productivity
If wafer-level packaging is implemented, then manufacturing efficiency and cost are improved, but the integration of conductive structures becomes more challenging
Solution Approach 1:
The conductive pads with their segmented regions (core contact, buffer contact, and testing regions) are formed and configured on the wafer before the packaging process. This preliminary formation of the conductive structure layout enables subsequent packaging steps to proceed more efficiently, as the conductive elements are already in their final positions and configurations, reducing the complexity of integration during later manufacturing stages.
3Reliability
If conductive pads with multiple regions are formed, then electrical connectivity and testing capability are enhanced, but the manufacturing process complexity increases
Solution Approach 1:
The core contact region, buffer contact region, and testing region are merged into a single integrated conductive pad structure formed through a unified manufacturing process. This combining of multiple functional regions into one cohesive structure enhances electrical connectivity across all regions while avoiding the need for separate fabrication processes for each region, thereby managing manufacturing process complexity.
Data Source
AI summary
An integrated circuit component includes a semiconductor substrate, conductive pads, a passivation layer and conductive vias. The semiconductor substrate has an active surface. The conductive pads are located on the active surface of the semiconductor substrate and electrically connected to the semiconductor substrate, and the conductive pads each have a contact region and a testing region, where in each of the conductive pads, an edge of the contact region is in contact with an edge of the testing region. The passivation layer is located on the semiconductor substrate, where the conductive pads are located between the semiconductor substrate and the passivation layer, and the testing regions and the contact regions of the conductive pads are exposed by the passivation layer. The conductive vias are respectively located on the contact regions of the conductive pads.