Segmented Passivation Structure with Crack-Blocking Groove
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Solution Overview
Problem
Existing passivation structures in semiconductor devices either allow cracks from blade cutting to spread to chips or cause chip collision during laser cutting, limiting the applicability of these methods due to inadequate protection and chip separation.
Innovation Solution
A passivation structure with a crack-blocking groove between first passivation patterns on semiconductor chips and second passivation patterns on scribe lanes, allowing for both blade and laser cutting without damaging the chips by preventing crack propagation and chip collision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the passivation layer is formed continuously on both scribe lanes and semiconductor chips, then chip protection is improved, but crack propagation to chips occurs during blade cutting
Solution Approach 1:
The passivation layer is segmented into two distinct patterns: a first passivation pattern on the semiconductor chip and a second passivation pattern on the scribe lane. These patterns are spaced apart to form a crack-blocking groove, which prevents cracks from propagating from the scribe lane to the chip while maintaining protective coverage on both surfaces
Solution Approach 2:
The crack-blocking groove acts as an intermediary barrier between the second passivation pattern (on scribe lane) and the first passivation pattern (on chip). This groove interrupts the continuous path that cracks would otherwise follow, serving as a mediator that blocks harmful crack propagation while allowing the passivation structures to remain in place
2Object-affected harmful factors
If the passivation layer is removed from scribe lane to prevent crack spread, then crack propagation is prevented, but chip separation and protection during laser cutting are compromised
Solution Approach 1:
Instead of removing the passivation layer entirely from the scribe lane, the solution segments it into a second passivation pattern that remains on the scribe lane but is spaced apart from the chip. This segmented structure provides both crack blocking and chip separation functionality during laser cutting
Solution Approach 2:
The second passivation pattern on the scribe lane serves multiple functions: it blocks crack propagation toward the chip, provides structural support during laser cutting, and maintains spacing to prevent chip collision. This multi-functional design eliminates the need to choose between crack protection and chip separation
3Productivity
If semiconductor chips are positioned adjacent to each other for laser cutting, then cutting efficiency is improved, but chip collision and damage occur during grinding
Solution Approach 1:
The second passivation pattern on the scribe lane acts as an intermediary spacer between adjacent semiconductor chips. During laser cutting and subsequent grinding, this intermediate structure prevents direct contact and collision between chips while maintaining close positioning for efficient processing
Solution Approach 2:
The second passivation pattern is formed on the scribe lane in advance before cutting operations. This preliminary structure pre-establishes the spacing mechanism that will prevent chip collision during subsequent grinding, eliminating the need for additional protective measures during manufacturing
Data Source
AI summary
A passivation structure may include a first passivation pattern on an upper surface of a semiconductor chip provided on a semiconductor substrate, and a second passivation pattern arranged on a scribe lane of the semiconductor substrate adjacent to the semiconductor chip. The second passivation pattern is spaced apart from the first passivation pattern to form a crack-blocking groove between the second passivation pattern and the first passivation pattern.