Segmented PCB Layer Stacks for Shielding and Component Access
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Solution Overview
Problem
There is a need for improved methods of manufacturing strip-line circuits on printed circuit boards (PCBs) that reduce fabrication complexity, cost, and time, while also providing easier access to components and enhanced inspection and test capabilities.
Innovation Solution
The solution involves creating PCBs with layer stacks that include cut-out areas to accommodate devices and components, allowing for modular design and assembly, along with gap areas for ease of assembly and inspection, and using conductive materials to form transmission lines and ground planes, enabling strip-line shielding and microstrip-like accessibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional multi-layer PCB construction is used to achieve strip-line shielding, then electromagnetic shielding is improved, but fabrication complexity and cost increase
Solution Approach 1:
The PCB structure is divided into separate layer stacks that can be manufactured independently and then assembled together. This segmentation allows each layer to be optimized for its specific function (shielding, signaling, grounding) while simplifying the overall fabrication process and reducing complexity compared to traditional multi-layer construction.
2Object-affected harmful factors
If traditional multi-layer PCB construction is used to achieve strip-line shielding, then electromagnetic shielding is improved, but manufacturing cost increases
Solution Approach 1:
By segmenting the PCB into separate assemblyable layer stacks, the manufacturing process becomes more efficient. Each layer can be manufactured using standard PCB processes and then assembled together, reducing the need for complex and expensive multi-layer fabrication techniques while maintaining effective electromagnetic shielding.
3Object-affected harmful factors
If traditional multi-layer PCB construction is used, then strip-line shielding is achieved, but access to components becomes difficult
Solution Approach 1:
The PCB structure transitions from a rigid multi-layer construction to a dynamic, assemblyable structure with separable layer stacks. This allows the PCB to be disassembled for component access and reassembled to maintain shielding, providing both electromagnetic protection and ease of component access.
Solution Approach 2:
The separable layer stacks enable physical access to components embedded within the PCB structure while maintaining the shielding integrity through proper reassembly. Critical layers remain connected for electrical continuity, while non-critical layers can be separated for component access.
4Object-affected harmful factors
If traditional multi-layer PCB construction is used, then strip-line shielding is achieved, but inspection and test capabilities are reduced
Solution Approach 1:
The dynamic, assemblyable nature of the separable layer stacks allows inspectors and testers to disassemble the PCB to access internal components and trace paths for thorough inspection and testing, while maintaining the shielding structure during the testing process.
Solution Approach 2:
The segmented layer structure provides natural access points for inspection and testing equipment to probe internal signals and components without compromising the overall shielding integrity. Each layer can be independently inspected before final assembly.
Data Source
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Figure 3
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AI summary
A printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a first electrically-conductive layer, and a cut-out area defining a void that extends therethrough. The first electrically-insulating layer includes a first surface and an opposite second surface. The first electrically-conductive layer is disposed on the first surface of the first electrically-insulating layer. The second layer stack includes a second electrically-insulating layer. The second electrically-insulating layer includes a first surface and an opposite second surface. One or more electrically-conductive traces are disposed on the first surface of the second electrically-insulating layer. The printed circuit board further includes a device at least partially disposed within the cut-out area. The device is electrically-coupled to one or more of the one or more electrically-conductive traces disposed on the first surface of the second electrically-insulating layer.