Segmented Performance Board for Semiconductor Test Reconfiguration
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Solution Overview
Problem
Conventional test apparatuses for semiconductor devices require costly reconfiguration of performance boards and diagnosis boards due to limited flexibility in test module arrangement, leading to increased costs and inefficient use of space.
Innovation Solution
A performance board and test apparatus design featuring a plurality of sub-boards with a fixing section that allows for flexible attachment and arrangement, enabling the connection of test modules with semiconductor devices, and a diagnosis board with sub-boards that can be rearranged to diagnose test modules efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the performance board is made per arrangement of the test modules, then the connection between test modules and device-under-test is ensured, but the production cost increases
Solution Approach 1:
The performance board is divided into multiple sub-boards, each capable of being independently manufactured and then assembled. This segmentation allows for standardized production of sub-boards that can be configured differently, reducing the need for custom-built boards for each test module arrangement and thereby lowering production costs while maintaining connection reliability.
Solution Approach 2:
The sub-boards are designed with universal connectors and standardized interfaces that allow them to be used across different test module configurations. A single sub-board design can serve multiple functions in different arrangements, eliminating the need to manufacture separate performance boards for each configuration and reducing overall production costs.
2Adaptability or versatility
If the performance board is divided into regions per semiconductor device, then the connection to multiple devices is enabled, but the board size and cost increase
Solution Approach 1:
The performance board is segmented into multiple sub-boards, each handling connections for specific semiconductor devices. This segmentation allows the system to accommodate multiple devices without requiring a single large board, as sub-boards can be selectively assembled based on the number and type of devices being tested, thereby reducing overall board size while maintaining multi-device capability.
Solution Approach 2:
Instead of expanding the area of a single performance board to accommodate multiple devices, the solution transitions to a multi-dimensional approach by stacking and arranging multiple sub-boards in three-dimensional space. This allows multiple device connections to be achieved through vertical and lateral arrangement of sub-boards rather than simply increasing the footprint of a single board.
3Reliability
If the diagnosis board has the same size as the performance board, then all test modules can be diagnosed, but the cost and space usage increase
Solution Approach 1:
The diagnosis board is divided into sub-boards corresponding to the performance board's sub-boards. This segmentation allows the diagnosis board to be configured with only the necessary sub-boards for diagnosing specific test modules, rather than requiring a full-sized diagnosis board matching the performance board's dimensions. This reduces cost and space usage while maintaining comprehensive diagnosis coverage through selective sub-board assembly.
4Adaptability or versatility
If test modules are freely rearranged in the test head, then the adaptability is improved, but the performance board reconfiguration cost increases
Solution Approach 1:
The performance board is segmented into standardized sub-boards with uniform connectors and interfaces. This segmentation enables the sub-boards to be freely rearranged to match different test module configurations in the test head. Since each sub-board is standardized, they can be interchangeably positioned and connected to accommodate various test module arrangements without requiring custom board designs, thereby maintaining adaptability while reducing reconfiguration costs.
Solution Approach 2:
The sub-boards are designed with universal connectors and standardized geometries that allow them to interface with different test module types and positions. This universality enables a single sub-board design to serve multiple functions across different arrangements, allowing the system to adapt to various test module configurations without manufacturing new specialized boards for each arrangement, thus reducing reconfiguration costs.
Data Source
AI summary
There is provided a test apparatus having a test head containing test modules for sending/receiving signals to/from a device-under-test, a device mounting section having a socket for mounting the device-under-test and a performance board placed on the test head to connect each terminal of the test module with each terminal of the device-under-test via the device mounting section, and the performance board has a plurality of sub-boards each containing a part of a plurality of wires for connecting the test module with the device-under-test and a fixing section for attaching and fixing the plurality of sub-boards in a body to the test head.