Segmented Planar Conductor for Shielded Substrate Inspection
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Solution Overview
Problem
Existing substrate flaw detection methods for component-embedded substrates face challenges in non-destructively inspecting internal structures due to electromagnetic shielding, which blocks ultrasonic, X-ray, or infrared waves used for crack detection.
Innovation Solution
A component-embedded substrate design featuring a multilayer body with a planar conductor on one side and additional conductors on the other, including openings that allow flaw detection waves to pass through, enabling accurate inspection while maintaining electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal film is used to electromagnetically shield the embedded IC chip, then electromagnetic noise is eliminated, but non-destructive inspection using ultrasonic waves, X-rays, or infrared rays is blocked
Solution Approach 1:
The planar conductor is divided into multiple segments by forming openings (through-holes or vias) within it. This segmentation allows flaw detection waves to pass through the conductor structure while the remaining conductor portions maintain electromagnetic shielding functionality. The segmented design resolves the contradiction by creating pathways for inspection waves without completely removing the shielding material.
Solution Approach 2:
Different regions of the planar conductor are given different properties: areas with openings allow wave transmission for inspection, while areas without openings provide electromagnetic shielding. This local differentiation of quality enables the same structure to simultaneously fulfill both shielding and inspection accessibility requirements.
2Object-affected harmful factors
If a planar conductor covers the embedded component, then electromagnetic shielding is achieved, but flaw detection waves are blocked from reaching the embedded component
Solution Approach 1:
The planar conductor is segmented by introducing multiple openings that allow flaw detection waves to penetrate through to the embedded component. This segmentation strategy maintains the overall shielding function while creating localized transmission paths for inspection waves, thereby resolving the detection difficulty.
Solution Approach 2:
The openings in the planar conductor act as intermediaries that facilitate the transmission of flaw detection waves from the inspection surface to the embedded component. These openings serve as mediation points that allow wave passage without compromising the surrounding shielding structure.
3Reliability
If a metal film is applied to shield the embedded component, then electromagnetic shielding effectiveness is improved, but the substrate cannot be non-destructively inspected with high accuracy
Solution Approach 1:
The continuous metal film is segmented into discrete conductor regions separated by openings. This segmentation reduces the blocking effect on inspection waves while preserving electromagnetic shielding through the remaining conductor areas, thereby improving both inspection precision and maintaining shielding reliability.
Solution Approach 2:
The planar conductor structure combines conductive material regions with non-conductive opening regions to create a composite structure. This composite design allows simultaneous achievement of electromagnetic shielding (by conductive parts) and wave transmission for inspection (through non-conductive openings).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-accuracy non-destructive inspection of internal structures by allowing ultrasonic, X-ray, or infrared waves to reach the embedded component, preventing blockage and ensuring electromagnetic shielding, thus effectively detecting cracks without damaging the substrate.
Implementation Method 1
a non-destructive inspection performed from the top side of the embedded IC chip to check for cracks using ultrasonic waves
Implementation Method 2
a non-destructive inspection performed from the top side of the embedded IC chip to check for cracks using ultrasonic waves, X-rays
Implementation Method 3
a non-destructive inspection performed from the top side of the embedded IC chip to check for cracks using ultrasonic waves, X-rays, or infrared rays
Implementation Method 4
the embedded IC chip is electromagnetically shielded by a metal film covering the embedded IC chip
Data Source
AI summary
A component-embedded substrate includes a multilayer body including a plurality of insulating layers stacked in a stacking direction, an embedded component embedded in the multilayer body, and planar conductors disposed on both sides of the embedded component in the stacking direction, the planar conductors overlapping the embedded component. The planar conductors each include a plurality of openings that overlap the embedded component over substantially the entire region occupied by the embedded component, as seen in the stacking direction.