Segmented Plated Through-Hole for High-Density PCB Routing
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Solution Overview
Problem
Current printed circuit boards face challenges in efficiently utilizing space due to the need for multiple metallized holes, which limits the number of independent circuit connections and increases noise and fabrication costs.
Innovation Solution
A plated through-hole design that allows for multiple independent circuit connections by using laser or mechanical machining to create circuit patterns on the surface of the hole, enabling reduced layer counts and increased routing density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple metallized holes are used to provide independent circuit connections, then the number of circuit connections is increased, but the space utilization is reduced and fabrication cost increases
Solution Approach 1:
The patent combines multiple independent circuit connections within a single metallized hole by using partition structures that divide the hole's interior space. This allows multiple circuits to share one hole, reducing the total number of holes needed and improving space utilization while maintaining circuit independence through the partitions.
Solution Approach 2:
The patent segments the interior of a single metallized hole into multiple independent regions using partition structures. These partitions create separate circuit paths within the same hole, enabling multiple independent connections without requiring multiple separate holes, thus solving the space utilization problem.
2Adaptability or versatility
If multiple metallized holes are used to provide independent circuit connections, then the number of circuit connections is increased, but fabrication cost increases
Solution Approach 1:
The patent merges multiple circuit connections into a single metallized hole structure, reducing the total hole count. This consolidation simplifies the fabrication process by requiring fewer drilling, plating, and filling operations, thereby reducing fabrication costs while still providing the needed number of independent circuit connections.
Solution Approach 2:
The patent uses partition structures segmented within a single hole to create multiple independent circuit paths. This approach requires only one hole formation and plating process, significantly reducing fabrication steps and costs compared to creating multiple separate holes, while still achieving the desired circuit independence.
3Ease of manufacture
If traditional plated holes are used, then manufacturing is simple, but signal integrity is degraded due to unterminated plated stubs and noise
Solution Approach 1:
The patent segments the plated material within the hole using partition structures, creating distinct circuit regions. This segmentation allows for proper termination of plated stubs in each segment, preventing signal integrity degradation and noise while maintaining a relatively simple manufacturing process that builds upon traditional plating techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the number of metallized holes required, improves signal integrity, and decreases noise by allowing parallel signal routing and reducing unterminated plated stubs, thereby lowering fabrication costs and enhancing circuit board performance.
Implementation Method 1
using laser or mechanical machining to create circuit patterns on the surface of the hole
Data Source
AI summary
Methods and apparatus for creating independent circuit connections within a through-hole of a substrate are described. According to one aspect of the present invention, a method includes defining a through-hole in a substrate, applying a conductive plating to a holewall of the through-hole, and selectively removing at least a first area of the plating. The through-hole has a height relative to a first axis, and the perimeter of the through-hole at each point along the first axis is approximately the same. Selectively removing the first area of the plating includes defining second areas of the plating. At least one of the plurality of second areas does not span a height of the hole.