Segmented Metal Plating Cooling Structure for Thermal Stress Relief
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Solution Overview
Problem
Heat sinks coated with sintered coatings face issues of shrinkage and stress impact due to thermal changes in power chips, which affect their performance.
Innovation Solution
A cooling structure with a metal plating layer comprising a substrate, a first metal plating layer formed by a wetting process, and a second metal plating layer formed by sputtering, featuring blocks arranged at unequal intervals to reduce stress impact, with the second layer being a silver/silver alloy for improved adhesion and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If sintered coatings are used to connect heat sinks with power chips, then the connection is achieved, but shrinkage of the coatings after sintering and stress impact from thermal changes occur
Solution Approach 1:
The second metal plating layer is divided into multiple blocks arranged at intervals rather than forming a continuous coating. This segmentation reduces the overall shrinkage stress and prevents uniform stress distribution that causes delamination, while still providing adequate connection points for power chips.
Solution Approach 2:
Different regions of the metal plating layer have different properties - the first metal plating layer provides a stress-absorbing intermediate structure, while the second metal plating layer blocks provide localized connection points. This local differentiation allows each region to perform its specific function optimally.
2Area of stationary object
If a continuous metal plating layer is formed, then complete coverage is achieved, but stress concentration and deformation risk increase
Solution Approach 1:
The continuous plating layer is replaced with discrete blocks arranged in a pattern. This segmentation maintains adequate coverage area for thermal and electrical connection while introducing stress relief zones between blocks that prevent stress concentration and reduce deformation risk.
3Reliability
If unequal interval arrangement of blocks is used, then stress impact is reduced, but manufacturing complexity increases
Solution Approach 1:
The blocks are arranged at unequal intervals rather than in a uniform pattern. This asymmetric arrangement disrupts stress concentration patterns and reduces overall stress impact on the plating layer, while the systematic nature of the arrangement (based on predetermined patterns) keeps manufacturing complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes shrinkage and stress impact on the cooling structure, reducing the likelihood of deformation and power die delamination, while enhancing heat dissipation through optimized plating layer arrangement and material selection.
Implementation Method 1
The first metal plating layer is formed on the substrate by a wetting process
Implementation Method 2
the second metal plating layer having a thickness ranging from 0.1 μm to 5 μm is formed on the first metal plating layer by a sputtering process
Data Source
AI summary
A cooling structure having a metal plating layer is provided with a substrate, a first metal plating layer and a second metal plating layer that are made of materials different from each other and formed on the substrate by different processes. The first metal plating layer is formed on the substrate by a wetting process. The second metal plating layer having a thickness ranging from 0.1 μm to 5 μm is formed on the first metal plating layer by a sputtering process. The second metal plating layer includes at least three blocks arranged at intervals, and at least two adjacent ones of the at least three blocks have a distance therebetween that is not equal to a distance between another two adjacent ones of the at least three blocks.