Segmented Power Mesh for Selective Bond-Out
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Solution Overview
Problem
Semiconductor devices often come with unnecessary circuit functionalities, leading to over-provisioning and inefficiencies, as they are not customizable enough for specific end-use applications, resulting in power leakage and increased costs.
Innovation Solution
The implementation of a semiconductor chip with segmented power meshes, where each circuit block is powered independently, allowing for selective enablement or disablement of circuitry based on intended use, reducing power consumption and enabling customization of devices by isolating power sources for each block.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single silicon die is used to create multiple chip products, then manufacturing cost is reduced, but device functionality becomes insufficient for specific end-use applications
Solution Approach 1:
The power mesh is divided into multiple electrically isolated segments, each capable of being independently powered. This segmentation allows different regions of the same silicon die to be activated or deactivated based on the specific application requirements, enabling a single die to serve multiple product configurations without requiring separate manufacturing processes.
2Adaptability or versatility
If all circuit blocks on a semiconductor die are always powered, then full functionality is available, but power consumption increases and leakage current occurs
Solution Approach 1:
The power mesh structure transitions from a static all-or-nothing power distribution to a dynamic configuration where individual segments can be independently activated. This dynamic power management allows the system to adapt power distribution to actual operational needs, reducing leakage current and power consumption by keeping unused circuit blocks in a low-power state while maintaining the capability to activate them when required.
3Loss of energy
If circuit blocks are isolated from power to reduce power consumption, then power leakage is minimized, but the ability to enable/disable functionality on-demand is lost
Solution Approach 1:
The power mesh is segmented into electrically isolated regions that can be independently controlled. Each segment can be connected to or disconnected from the power source through selective bonding of power mesh segments to external terminals, enabling on-demand activation of specific circuit blocks while maintaining electrical isolation to prevent leakage current to inactive blocks.
4Device complexity
If a single power mesh is used for the entire die, then device complexity is reduced, but selective powering of circuit blocks becomes impossible
Solution Approach 1:
The power mesh is divided into multiple electrically isolated segments that can be independently connected to power sources. This segmentation enables selective powering of different circuit blocks on the same die, allowing customization of device functionality while maintaining a relatively simple overall structure that does not require complex power management circuitry.
Data Source
AI summary
A semiconductor chip includes a semiconductor die formed on a substrate, a first power mesh formed on the substrate, and a second power mesh formed on the substrate electrically isolated from the first power mesh. The semiconductor chip also includes a first circuit block formed on the substrate and electrically connected to the first power mesh, and a second circuit block formed on the substrate and electrically connected to the second power mesh. The first circuit block and the second circuit block are communicatively coupled to a first plurality of external circuit connections and a second plurality of external circuit connections, respectively. The semiconductor chip also includes one or more first signal pins and one or more second signal pins formed on the substrate, the first and second signal pins designed to receive external signals.