Segmented Power Module Substrates for High-Temperature Durability
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Solution Overview
Problem
High-performance power modules in eco-friendly vehicles face durability issues due to substrate bending at high temperatures, and high manufacturing costs, which are exacerbated by the need for larger substrates to accommodate increased chip numbers and sizes for improved power handling.
Innovation Solution
A power module design featuring separately configured insulating substrates with a connection spacer for electrical connection, optimized bus bar arrangement to reduce internal parasitic inductance, and the use of different semiconductor types (SiC and Si) for high-temperature durability and reliability, with integrally molded substrates and bus bars to minimize size and bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the size of insulating substrate is increased to accommodate more chips and higher power specifications, then the power handling capability is improved, but the substrate becomes more vulnerable to bending at high temperatures, resulting in durability problems
Solution Approach 1:
The insulating substrate is divided into multiple separate substrates (first insulating substrate and second insulating substrate) that are connected through a connection substrate. This segmentation allows each substrate to be smaller in size, reducing thermal deformation and bending, while still accommodating the required number of chips and maintaining high power handling capability through the interconnected structure.
2Power
If the number and size of chips are increased to cover the amount of power, then the power handling capability is improved, but the size of each substrate must be increased, making it vulnerable to bending due to high temperature
Solution Approach 1:
The substrate system is segmented into multiple smaller substrates rather than using one large substrate. This allows the chips to be distributed across multiple smaller boards, reducing the size of each individual substrate and thereby reducing thermal deformation, while maintaining the total power handling capability through the combined capacity of all chips across the segmented substrates.
Solution Approach 2:
The substrate configuration transitions from a two-dimensional planar arrangement to a three-dimensional stacked structure with connection substrates linking multiple insulating substrates vertically. This dimensional change allows compact arrangement of chips across multiple layers, reducing the footprint of each substrate while accommodating increased chip count and power handling requirements.
3Ease of manufacture
If a single large-sized insulating substrate is used, then the manufacturing process is simplified, but bending largely occurs at high temperature by chip operation, requiring a method to secure both high performance and durability
Solution Approach 1:
The single large substrate is segmented into multiple smaller substrates connected through connection substrates. While this increases the number of components, it significantly improves high-temperature durability by reducing thermal deformation in each substrate. The modular segmented structure also facilitates standardized manufacturing processes for each smaller substrate unit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances high-temperature durability and reliability by reducing substrate size and bending, while optimizing bus bar arrangement to lower internal parasitic inductance, thereby improving the power module's performance and reducing manufacturing costs.
Implementation Method 1
a connection spacer configured to electrically connect the first substrate and the second substrate
Implementation Method 2
The first substrate may be configured to have a relatively high thermal conductivity characteristic compared to the second substrate
Data Source
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AI summary
An embodiment is power module including a plurality of first switching elements of a first type semiconductor on a first substrate, a plurality of second switching elements of a second type semiconductor and a third switching element of the first type semiconductor or the second type semiconductor on a second substrate, wherein the first substrate has a different thermal conductivity than the second substrate, and a connection spacer configured to electrically connect the first substrate and the second substrate.