Segmented Repair Line with Integrated OPAs for TFT-LCD
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Thin film transistor liquid crystal display (TFT-LCD) panels face manufacturing defects such as data line breakpoints, where repair lines have higher impedance and longer transmission paths, resulting in reduced voltage delivery due to impedance and capacitance effects, necessitating the use of operational amplifiers with large driving capability on printed circuit boards.
Innovation Solution
The method involves dividing the repair line into segments, with operational amplifiers placed within gate driving chips to amplify signals, reducing impedance and capacitance effects, and optimizing the wiring layout to minimize the need for external operational amplifiers, thereby reducing costs and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a repair line is disposed on the non-display area for transmitting data to the breakpoint, then the data line breakpoint defect can be repaired, but the impedance of the repair line is larger and the voltage transmitted to the breakpoint is less than the target voltage due to impedance and capacitance effects
Solution Approach 1:
The repair line is divided into multiple segments with operational amplifiers placed at specific positions along the repair line. This segmentation allows the repair line to be broken into manageable sections, each with controlled impedance characteristics, and enables intermediate signal amplification to compensate for voltage loss caused by impedance and capacitance effects.
Solution Approach 2:
Operational amplifiers are introduced as intermediary components along the repair line to actively compensate for the impedance and capacitance effects. These amplifiers boost the signal strength at critical points, ensuring that the voltage transmitted to the breakpoint meets the target voltage requirement despite the long transmission path.
2Power
If an operational amplifier with large driving capability is disposed on the printed circuit board for providing large output push capability of the repair line, then the voltage transmission requirement can be met, but the device complexity and cost increase
Solution Approach 1:
Instead of using a single operational amplifier with large driving capability on the printed circuit board, the invention distributes multiple operational amplifiers with moderate driving capability along the repair line itself. This local distribution allows each amplifier to handle only the local signal amplification requirement, reducing the burden on individual components and simplifying the overall circuit design.
Solution Approach 2:
The operational amplifiers are moved from the printed circuit board dimension to the film dimension, integrated directly into the repair line structure. This dimensional transition allows the amplifiers to be positioned closer to where they are needed, reducing connection lengths and improving signal integrity while lowering the complexity of the printed circuit board design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the impedance of the repair line, lowers the requirements for operational amplifiers, optimizes circuit layout, and decreases product costs and power consumption while maintaining effective data driving capability.
Implementation Method 1
an output end of the operational amplifier (OPA) is electrically connected to the output end of the gate driving chip through the second part for amplifying the repair signal transmitted through the repair line
Data Source
AI summary
A repair method of a display panel comprises: disposing a repair line on a non-display area; dividing the repair line into a first, a second, and a third segments sequentially connected; electrically connecting the first end of the target data line to an input end of the gate driving chip through the first segment; dividing the second segment of the repair line into a first and second parts, wherein the second part electrically connects the operational amplifiers (OPAs) of the gate driving chip for amplifying the repair signal transmitted through the repair line, and the first part electrically connects two gate driving chips; electrically connecting the last output end of the gate driving chip to the second end of the target data line through the third segment, for transmitting the repair signal amplified by the (OPA) to the breakpoint through the second end of the target data line.