Electronic Component Packaging With Segmented Rewiring Assembly
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Solution Overview
Problem
Existing methods for manufacturing semiconductor packages with fine rewiring result in a decrease in yield ratio and handling challenges due to the integration of electronic components and rewiring.
Innovation Solution
A method involving the separate preparation of a sealing structure with a sealing layer and a rewiring structure, bonded with an insulating adhesive layer, where the rewiring protrudes from the sealing structure, followed by an external sealing layer to form a connected body, allowing for precise rewiring formation and selection of non-defective components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If fine rewiring is formed on the structure including the electronic component sealed in the sealing layer, then the integration of electronic components and rewiring is achieved, but the yield ratio decreases and handling becomes difficult
Solution Approach 1:
The patent divides the electronic component device into separate structures: a sealing structure containing the electronic component and a separate rewiring structure. This segmentation allows each part to be manufactured and inspected independently, improving yield ratio by enabling selection of non-defective components before assembly, while still achieving the integrated functionality when combined.
2Device complexity
If fine rewiring is formed on the structure including the electronic component sealed in the sealing layer, then the integration of electronic components and rewiring is achieved, but handling becomes difficult
Solution Approach 1:
By separating the sealing structure from the rewiring structure, the patent makes each component easier to handle independently. The sealing structure with the electronic component can be handled separately from the fine rewiring structure, reducing the risk of damage and improving ease of operation during manufacturing and assembly processes.
3Ease of manufacture
If the rewiring structure is bonded to the sealing structure with the insulating adhesive layer, then the connected body is formed, but the protruding portion may be damaged
Solution Approach 1:
The patent applies an external sealing layer to the protruding portion of the rewiring structure before bonding. This external sealing layer acts as a protective cushion that prevents damage to the protruding portion during the bonding process and subsequent handling, while still allowing the bonding to proceed effectively.
4Reliability
If the external sealing layer is extended to the position on the protruding portion, then the protection is enhanced, but the manufacturing complexity increases
Solution Approach 1:
The external sealing layer is applied to the protruding portion in advance, before the bonding process. This preliminary action simplifies the overall manufacturing process by protecting the vulnerable protruding portion beforehand, rather than requiring complex protective measures during subsequent bonding and assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient manufacturing with high accuracy and improved yield ratio by allowing separate handling and selection of non-defective components, reducing damage to protruding portions and enhancing handling of electronic component devices.
Implementation Method 1
bonding the sealing structure and the rewiring structure in a direction that the circuit surface and the plurality of bumps face each other, with an insulating adhesive layer intervening
Data Source
AI summary
Disclosed is a method for manufacturing an electronic component device, including: preparing a sealing structure having a sealing layer having two opposing main surfaces, an electronic component, and a connection portion, the connection portion being exposed on a circuit surface that is one main surface of the sealing layer; preparing a rewiring structure having a rewiring portion having two opposing main surfaces, and a plurality of bumps; and bonding the sealing structure and the rewiring structure in a direction that the circuit surface and the plurality of bumps face each other, with an insulating layer intervening.