Segmented Ring Structure for Multi-Chip Package Warpage Control

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Solution Overview

Problem

Forming a reliable chip package structure with multiple chips is challenging due to stress concentration and warpage issues, particularly at the gaps between chip structures, which can lead to cracks and delamination.

Innovation Solution

A chip package structure design that includes a ring structure with specific modifications, such as removing portions of the ring structure near gaps and using lids to reduce stress concentration, thereby maintaining anti-warpage ability and improving yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a ring structure is used to provide anti-warpage ability, then structural support is improved, but stress concentration at gaps between chips increases leading to cracks and delamination

Engineering Contradiction:

Improveanti-warpage abilityVSAvoidcrack and delamination resistance

Core Design Contradiction:

Stability of the object's compositionVSReliability

Solution Approach 1:

The continuous ring structure is segmented by removing portions to create a discontinuous structure. This segmentation reduces stress concentration at the gaps between chips while maintaining the overall anti-warpage capability of the ring structure, thereby resolving the contradiction between structural support and reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The ring structure is modified with different properties in different regions: portions are removed specifically at locations corresponding to gaps between chips to reduce stress concentration, while other portions maintain the anti-warpage function. This local modification addresses the specific problem area without compromising overall structural integrity.

Inventive Principle:

Principle #3Local quality

2Adaptability or versatility

If multiple chips are integrated in a single package, then functionality is improved, but stress concentration and warpage issues increase

Engineering Contradiction:

Improvemulti-functionalityVSAvoidstress and warpage resistance

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The ring structure is divided into segments with portions removed at strategic locations corresponding to gaps between chips. This segmentation allows the package to accommodate multiple chips with different functions while reducing stress concentration at the interfaces, thus maintaining reliability despite increased functionality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The modified ring structure acts as an intermediary element between multiple chips with different functional requirements. By removing portions at gap locations, it mediates the stress interactions between adjacent chips, preventing stress concentration while supporting the multi-functional integration.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS20250323106A1Chip package structure with ring structure

Publication Date: 2025.10.16 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a first chip structure and a second chip structure over the wiring substrate. The first chip structure is spaced apart from the second chip structure by a gap. The chip package structure includes a first adhesive layer over the wiring substrate. The first adhesive layer has a first opening, the first chip structure and the second chip structure are in the first opening, the first opening has a first inner wall, the first inner wall has a first recess, and the gap extends toward the first recess. The chip package structure includes a ring structure over the first adhesive layer. The ring structure has a second opening over the first opening.