Segmented Metal Routing Test Structure for Micro-Residue Short Detection

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Solution Overview

Problem

Traditional comb-shaped test element groups for metal routing layers are inadequate in detecting micro metal residue-induced metal-metal short issues in advanced integrated circuit designs, as they cannot define diverse metal routing patterns and are limited by smaller semiconductor device sizes.

Innovation Solution

A test element group comprising a line region with comb teeth portions and a bulk region, where the comb teeth portions are separated by first gaps extending along their outlines, allowing for the detection of metal-metal short issues in new metal routing designs, with a larger bulk region area to accommodate diverse patterns and specific shapes of extending segments.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional comb-shaped test element groups are used, then the structure is simple and easy to manufacture, but they cannot detect metal-metal short issues in advanced integrated circuit designs with smaller device sizes

Engineering Contradiction:
Improvedetection capability for metal-metal short issuesVSAvoidtest element group structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The test element group is segmented into a line region with comb teeth portions and a bulk region, where the comb teeth portions are separated by gaps. This segmentation allows the test structure to define diverse metal routing patterns and detect metal-metal short issues that traditional comb-shaped structures cannot detect, while maintaining manufacturability through systematic division of the test area.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent extends the traditional two-dimensional comb shape into a three-dimensional configuration by adding extending segments that protrude from the bulk region. This dimensional extension allows the test element group to accommodate diverse metal routing patterns and detect shorts in multiple directions, improving detection capability without proportionally increasing overall complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Quantity of substance

If the metal lines and spacing are reduced to achieve denser semiconductor devices, then the device density increases, but micro-defects directly affect product reliability and induce metal-metal short issues

Engineering Contradiction:
Improvedevice densityVSAvoidproduct reliability
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The test element group is formed preliminarily on the wafer before final product testing, using the same metal routing layer formation process. This preliminary test structure allows detection of micro-defects and metal-metal short issues before they affect product reliability, enabling early identification of problems caused by reduced metal line spacing in dense device configurations.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The test element group uses the same metal routing layer and formation process as the actual semiconductor devices, making the test structure self-service to the manufacturing process. The test elements are formed simultaneously with the metal routing layers they test, requiring no additional material deposition steps and automatically adapting to the actual metal line spacing and patterns used in the dense device configuration.

Inventive Principle:
Principle #25Self-service

3Adaptability or versatility

If traditional comb-shaped test element groups are used, then the manufacturing process is simple, but they cannot define all kinds of metal routing layers

Engineering Contradiction:
Improvecapability to define diverse metal routing patternsVSAvoidmanufacturing process simplicity
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The test element group with line region and bulk region serves multiple functions: it can define diverse metal routing patterns, detect metal-metal short issues in various directions, and work with different semiconductor device configurations. The comb teeth portions with extending segments can accommodate horizontal, vertical, and diagonal routing patterns, making the test structure universal for testing various metal routing layer designs while using the same standard manufacturing processes.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20240186194A1Test element group for metal routing layer and manufacturing method thereof
Publication Date: 2024.06.06 NAN YA TECH
  • US20240186194A1 patent drawing
  • US20240186194A1 patent drawing
  • US20240186194A1 patent drawing

AI summary

A test element group for a metal routing layer includes a line region and a bulk region. The line region has a connection portion and a plurality of comb teeth portions connected to and perpendicular to the connection portion, in which each of the comb teeth portions has a plurality of extending segments separated from each other. The bulk region surrounding the extending segments of the comb teeth portions, in which the comb teeth portions are separated from the bulk region by a plurality of first gaps that respectively extend along outlines of the comb teeth portions.