Segmented Seal Ring Structure for Chip Crack Protection
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Solution Overview
Problem
Existing electronic chips are vulnerable to cracks during manufacturing and lifetime, with conventional seal rings failing to effectively prevent crack propagation to the electronic circuit region.
Innovation Solution
The electronic chip design incorporates a seal ring with a plurality of cavities or conductive regions forming a continuous ring-shaped cavity or wall around the electronic circuit region, enhancing protection against crack propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional seal ring is used to protect the electronic circuit region, then crack propagation is partially prevented, but the protection is insufficient and cracks can still reach the circuit region
Solution Approach 1:
The seal ring is segmented into multiple discrete seal elements arranged in a ring pattern around the electronic circuit region. Each seal element independently contributes to crack prevention, and the segmented structure allows for better stress distribution and more effective crack propagation blocking compared to a continuous seal ring.
Solution Approach 2:
The seal elements are formed using composite structures involving conductive layers and insulating layers. The conductive layers provide mechanical strength and crack resistance, while the insulating layers provide electrical isolation and additional structural support, creating a composite seal structure with enhanced protection capabilities.
2Reliability
If the seal ring structure is enhanced to improve crack protection, then reliability increases, but manufacturing complexity increases
Solution Approach 1:
The formation of the seal ring structure is merged with the existing metallization level fabrication processes. The conductive layers and insulating layers are deposited and patterned using the same equipment and techniques already employed for creating interconnection structures, eliminating the need for separate dedicated seal ring manufacturing equipment or processes.
Solution Approach 2:
The seal ring structure serves multiple functions: it provides crack protection, electrical isolation, and mechanical support. By designing the seal elements to fulfill multiple roles simultaneously using the same fabrication processes, the patent avoids increasing manufacturing complexity while achieving enhanced reliability.
3Reliability
If a continuous seal ring is used to block crack propagation, then protection is improved, but stress concentration may occur leading to seal ring failure
Solution Approach 1:
The seal ring is divided into multiple discrete seal elements spaced around the circuit region. This segmentation prevents stress concentration in a single continuous structure, as each seal element independently absorbs and distributes mechanical stress, reducing the likelihood of catastrophic failure while maintaining effective crack propagation blocking.
Solution Approach 2:
The seal elements are strategically positioned at locations where crack propagation is most likely to occur, providing localized protection where needed most. The segmented structure allows for optimized placement of seal elements at high-stress regions while maintaining overall structural integrity through the distributed arrangement.
Data Source
AI summary
The present description concerns an electronic chip delimited by an edge and comprising a semiconductor layer extending along a main plane, an interconnection structure positioned above the semiconductor layer, and a seal ring arranged in the interconnection structure between the edge of the electronic chip and an electronic circuit region of the electronic chip. The seal ring comprises a plurality of cavities coupled together to form at least one continuous ring-shaped cavity around the electronic circuit region, and/or a plurality of conductive regions coupled together to form at least one conductive ring-shaped wall around the electronic circuit region.