Segmented Seal Ring Layout for Moisture-Resistant Chip Dicing
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Solution Overview
Problem
Existing semiconductor wafers face damage during dicing processes due to moisture ingress and mechanical stress, which current guard rings and seal structures fail to adequately address in terms of process compatibility and effectiveness.
Innovation Solution
The implementation of segmented seal rings with insulator layers and protective structures in the interconnect layer, which extend through the interconnect layer to abut the substrate, providing enhanced moisture barriers and mechanical integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional guard rings and seal structures are used, then moisture barrier function is provided, but process compatibility and effectiveness are insufficient
Solution Approach 1:
The seal ring is divided into multiple segments (first seal ring segment, second seal ring segment, third seal ring segment) that can be independently formed and positioned. This segmentation allows the seal structure to be integrated with the interconnect formation process while maintaining effective moisture barrier functionality. Each segment can be formed in separate trenches and connected through conductive vias, enabling process compatibility with standard semiconductor manufacturing flows.
Solution Approach 2:
The seal ring structure serves multiple functions: it acts as a moisture barrier, provides mechanical support, and integrates with the interconnect layer system. The same segmented structure that forms part of the electrical interconnect system also provides the seal function, eliminating the need for separate dedicated seal structures and improving process compatibility.
2Reliability
If segmented seal rings with insulator layers are implemented, then moisture barrier effectiveness is improved, but device complexity increases
Solution Approach 1:
The insulator layer is merged with the existing interconnect dielectric layers rather than being added as a separate complex structure. The seal ring segments are formed within the interconnect layer system, utilizing the same manufacturing processes for trench formation, insulation deposition, and conductive filling that are already part of the interconnect fabrication flow.
Solution Approach 2:
The insulator material used in the seal ring structure is the same as or similar to the interconnect dielectric material, creating a homogeneous structure that simplifies manufacturing. This approach avoids introducing new materials and processes, thereby reducing device complexity while maintaining the segmented design for improved moisture barrier effectiveness.
3Strength
If seal rings extend through the interconnect layer to abut the substrate, then mechanical integrity is enhanced, but manufacturing difficulty increases
Solution Approach 1:
The trenches for the seal ring segments are formed and the insulator layers are deposited before the final interconnect structures are completed. This preliminary action allows the seal structure to be established early in the process, providing mechanical support from the beginning and simplifying subsequent manufacturing steps by having a stable foundation in place.
Solution Approach 2:
The seal ring is divided into multiple segments that can be independently formed in separate process steps. Each segment can be created using standard trench isolation and conductive filling processes, making the overall structure easier to manufacture despite extending through the entire interconnect layer. The segmented approach allows for better process control and integration with existing manufacturing capabilities.
Data Source
AI summary
Semiconductor devices including seal rings and method of making the same is provided. A semiconductor device comprises an interconnect layer over a substrate. The interconnect layer comprises a barrier layer over a dielectric layer. A seal ring is in the interconnect layer and the seal ring extends through the interconnect layer to abut the substrate. An insulator layer is around the seal ring and the insulator layer spaces the seal ring from the barrier layer. A protective structure is laterally adjacent to the seal ring and the protective structure extends through the interconnect structure to abut the substrate. The seal ring may be segmented and comprises a first segment in a first trench in an interconnect stack, and a second segment in a second trench in the interconnect stack.