Light Source With Segmented Semiconductor Bodies
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for producing light-emitting diodes lack efficient control and separation of semiconductor bodies, leading to limitations in miniaturized full-color displays and optical projection devices, where precise control and separate operation of semiconductor bodies are necessary for generating different colors of light.
Innovation Solution
A method involving a radiation-transmissive carrier with spatially separated semiconductor bodies, each connected to a CMOS chip with unique connection points, allowing for separate control and connection of semiconductor bodies to generate electromagnetic radiation, and the use of conversion elements for wavelength conversion to produce red, green, and blue light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If semiconductor bodies are spatially separated and each is connected to a unique connection point on a CMOS chip, then control precision and color generation capability are improved, but device complexity and wiring requirements increase
Solution Approach 1:
The light-emitting device is segmented into multiple independently controllable semiconductor bodies (first, second, and third semiconductor bodies) that can be selectively activated. Each semiconductor body is associated with specific connection points on the CMOS chip, enabling precise control over which light-emitting elements are active. This segmentation allows for precise color control by activating only the necessary semiconductor bodies for the desired color output.
Solution Approach 2:
The CMOS chip serves multiple functions: it provides the control logic for selecting which semiconductor bodies to activate, and it also serves as the connection interface through its connection points. This multi-functionality reduces the need for separate dedicated control circuits, thereby managing wiring complexity while maintaining control precision.
2Adaptability or versatility
If semiconductor bodies are spatially separated for independent control, then color generation capability is improved, but manufacturing complexity increases
Solution Approach 1:
The device is divided into multiple semiconductor bodies that can be independently controlled to generate different colors. This segmentation enables versatile color generation by selectively activating specific semiconductor bodies, while the modular structure facilitates standardized manufacturing processes for each segment.
Solution Approach 2:
The patent employs a growth substrate during the manufacturing process that allows semiconductor bodies to be epitaxially grown in a controlled and standardized manner. This preliminary structuring on the growth substrate simplifies the subsequent separation and assembly processes, reducing manufacturing complexity despite the spatial separation of semiconductor bodies.
3Volume of moving object
If growth substrate is removed from semiconductor bodies, then manufacturing flexibility and miniaturization are improved, but handling and assembly difficulty increases
Solution Approach 1:
The growth substrate is extracted (removed) from the semiconductor bodies after the epitaxial growth process is complete. This extraction enables miniaturization of the final device by eliminating the bulky growth substrate, while the semiconductor bodies retain their structurally optimized configurations from the growth process.
Solution Approach 2:
The growth substrate serves as a preliminary support structure during manufacturing that enables precise epitaxial growth of semiconductor bodies. Once the semiconductor bodies are formed with their desired structures, the growth substrate is removed, leaving the miniaturized semiconductor bodies ready for assembly. This preliminary use of the growth substrate simplifies the overall manufacturing process despite the subsequent removal step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise control and generation of different colors of light, reducing the need for complex wiring and allowing for the use of inexpensive light-emitting diodes with small cross-sectional areas, improving the accuracy and efficiency of light production in miniaturized displays and optical projection devices.
Implementation Method 1
Each of the semiconductor bodies is provided for generating electromagnetic radiation, and for this purpose the semiconductor bodies can be controlled separately from one another
Implementation Method 2
to which a conversion material is added in each case, which converts the electromagnetic radiation generated in the light-emitting diode chips into red, green or blue light
Data Source
Figure 1A~1C
Figure 1D~1F
Figure 2A~2C
AI summary
The invention specifies a method for manufacturing a light source, having the following steps: provision of a multiplicity of light-emitting diodes (4), wherein each light emitting-diode has a radiolucent carrier (44) and at least two physically isolated semiconductor bodies (41, 42, 43), each semiconductor body (41, 42, 43) is provided for the purpose of producing electromagnetic radiation, the semiconductor bodies (41, 42, 43) can be actuated in isolation from one another and the semiconductor bodies (41, 42, 43) are arranged on the top (44a) of the radiolucent carrier (44), provision of a chip composite (1) comprising CMOS chips (10), wherein each CMOS chip (10) has at least two connection points (2) on the top (10a) thereof, connection of at least one of the light-emitting diodes (4) to one of the CMOS chips (10), wherein the light-emitting diode (4) is arranged on the top (44a) of the radiolucent carrier (44) on the top (10a) of the CMOS chip (10), and each semiconductor body (41, 42, 43) of the light-emitting diode is connected to a connection point (2) of the CMOS chip (10).