Segmented Semiconductor Module Layout for Flexible Circuit Configurations
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Solution Overview
Problem
The existing semiconductor module design requires a new base plate for each change in circuit configuration, leading to low production efficiency as the base plate cannot be used in common across different semiconductor modules.
Innovation Solution
A semiconductor module design where multiple base plates are arranged with gaps on the same plane and connected using conductive connection members that can connect either directly or indirectly to the base plates, allowing for common use across different circuit configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a new base plate is created for each circuit configuration change, then the circuit configuration can be customized, but the base plate cannot be used in common and production efficiency decreases
Solution Approach 1:
The base plate is divided into multiple independent connection regions, each capable of being connected to semiconductor elements through connection members. This segmentation allows different portions of the base plate to be activated or deactivated depending on the required circuit configuration, enabling one base plate to serve multiple circuit designs without requiring new base plates for each configuration.
Solution Approach 2:
The base plate is designed with multiple connection regions and support structures that can accommodate various semiconductor elements and connection patterns. By providing universal connection capabilities across different regions, a single base plate can support multiple circuit configurations, eliminating the need for product-by-product individual base plates and improving production efficiency.
2Adaptability or versatility
If connection members are used to connect base plates via semiconductor elements, then circuit configurations can be changed by reconfiguring connections, but the connection structure becomes more complex
Solution Approach 1:
Connection members serve as intermediaries between the base plate and semiconductor elements, providing a standardized interface for electrical connection. These connection members simplify the overall structure by providing uniform connection points that can be reused across different configurations, reducing the complexity that would otherwise arise from creating custom connection structures for each circuit design.
Solution Approach 2:
The base plate is pre-configured with multiple connection regions and support structures during manufacturing, allowing for flexible circuit configurations to be achieved through simple reconnection of semiconductor elements rather than requiring complex reconfiguration of the base plate itself. This preliminary preparation of connection infrastructure reduces the complexity of subsequent configuration changes.
Data Source
AI summary
This semiconductor module includes: a plurality of base plates made of conductive members and formed in plate shapes; at least one semiconductor element joined to a one-surface side of at least one of the base plates; and at least one connection member made of a conductive member and connecting one-surface sides of two or more of the base plates. The plurality of base plates are arranged with gaps therebetween on the same plane. The connection member has one or both of a semiconductor element connection portion which is a part connected to the base plate via the semiconductor element, and a base plate connection portion which is a part directly connected to the base plate.