Segmented Shell for MEMS Microspeaker Protection
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Solution Overview
Problem
Micro sound producing devices, such as MEMS microspeakers, require protection due to their small size and fragile structure, necessitating a package structure that enhances yield rate, reliability, and uniformity while minimizing the adverse impact of dust and liquid.
Innovation Solution
A sound producing package structure comprising a shell with a top, bottom, and sidewall structure that houses a chip with a thin film actuator, where the chip is configured to produce acoustic waves, and a manufacturing method involving the assembly of these components to form a sealed package with openings for wave propagation, optionally with mesh coverings to prevent dust and liquid ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a package structure is provided to protect the micro sound producing device, then reliability is improved, but device complexity increases
Solution Approach 1:
The package structure is divided into multiple components: a bottom structure, a sidewall structure, and a top structure. These segmented parts are assembled together to form the complete package, allowing for simplified manufacturing and assembly while providing comprehensive protection for the micro sound producing device
Solution Approach 2:
The micro sound producing device is nested inside the package structure formed by the bottom, sidewall, and top structures. This nesting arrangement protects the fragile device while maintaining a compact overall form factor
2Reliability
If the package structure is sealed to prevent dust and liquid ingress, then reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The bottom structure, sidewall structure, and top structure are prepared and positioned in advance during the assembly process. The sidewall structure is disposed on the bottom structure, and the top structure is subsequently attached to complete the sealed package, ensuring proper sealing without requiring excessive precision during final assembly
Solution Approach 2:
The sidewall structure acts as an intermediary component that connects the bottom structure and the top structure. This intermediate element facilitates the assembly process and helps achieve reliable sealing while managing manufacturing precision requirements
3Productivity
If the package structure is downsized to match the small size of the micro sound producing device, then productivity is improved, but reliability decreases
Solution Approach 1:
The package structure utilizes thin-walled yet structurally sound designs for the bottom, sidewall, and top structures. These thin structures provide adequate protection for the micro device while minimizing the overall package size, enabling downsizing without compromising reliability
Data Source
AI summary
A sound producing package structure includes a shell and a chip. The shell includes a top structure, a bottom structure and a sidewall structure. The chip is disposed inside the shell and configured to produce an acoustic wave, wherein the chip includes a thin film structure and an actuator configured to actuate the thin film structure, and the thin film structure is substantially parallel to the top structure and the bottom structure. A first opening is formed on the sidewall structure, and the acoustic wave propagates outwards through the first opening.