Segmented Shielding Structure for Semiconductor Lead Crosstalk
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Solution Overview
Problem
Existing semiconductor devices with a large number of leads face challenges in reducing signal crosstalk without sacrificing the number of leads available for signal transmission, as traditional methods like cutting the lead frame or connecting every other lead to ground are impractical.
Innovation Solution
A shielding structure comprising a base and elongated fingers made of conducting material, extending between adjacent leads, which are connected to a grounded lead or die, providing effective shielding without reducing the number of signal-carrying leads, and can be adapted to fit between leads with varying spacings and angles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional shielding methods (cutting lead frame or connecting every other lead to ground) are used, then signal crosstalk is reduced, but the number of leads available for signal transmission is reduced
Solution Approach 1:
The shielding structure is divided into multiple elongated fingers that extend between different pairs of adjacent leads. Each finger provides localized shielding for specific lead pairs, allowing comprehensive shielding across all leads without needing to sacrifice any leads for grounding purposes. This segmented approach enables effective crosstalk reduction while maintaining maximum lead utilization for signal transmission.
Solution Approach 2:
The shielding structure acts as an intermediary element positioned between adjacent leads. The conducting material fingers create intermediate shielding zones that block electromagnetic coupling between signal leads without requiring the leads themselves to be modified or sacrificed. This intermediary shielding layer reduces crosstalk while preserving all leads for their intended signal carrying function.
2Object-affected harmful factors
If shielding structure is added between leads, then cross-coupling is reduced, but device complexity increases
Solution Approach 1:
The shielding structure is designed to be universally applicable to lead frames with varying numbers and arrangements of leads. The modular finger configuration can be adapted to different package types and lead counts without requiring complete redesign. This universal design approach reduces complexity by providing a standardized shielding solution that works across multiple device configurations.
Solution Approach 2:
The shielding structure uses thin conducting material fingers that are electrically connected to a grounded lead or die. These thin film-like fingers provide effective electromagnetic shielding while occupying minimal space and adding minimal structural complexity. The flexible, thin-profile design allows the shielding structure to conform to the space between leads without creating bulky or complex three-dimensional structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shielding structure effectively reduces cross-coupling between signal leads, allowing all leads to be shielded without reducing their number, and can be used in various semiconductor devices, including those with multiple leads, by conforming to the space between leads and being electrically isolated from the die flag.
Implementation Method 1
A shielding structure comprising a base and elongated fingers made of conducting material, extending between adjacent leads, which are connected to a grounded lead or die, providing effective shielding
Data Source
AI summary
A shielding structure for use with semiconductor devices. The shielding structure has a base with fingers that are sized and shaped to extend within the space between pairs of adjacent leads. The base extends within the space between the die flag and the leads. The shielding structure is further connected to one of the grounded leads.