Segmented Silicide Fuse for Low-Current OTP Programming

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Solution Overview

Problem

Existing one-time programmable (OTP) devices face challenges in shrinking technology nodes and low-power applications due to high programming currents required for fuse elements, leading to obstacles in transistor size reduction and power efficiency.

Innovation Solution

The OTP device incorporates a fuse element with a silicon-containing line and silicide portions separated by a predetermined distance, allowing for a lower programming current to blow out the fuse, reducing transistor size and power consumption while maintaining high resistance differences for logic states.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If high programming current is used to blow out the fuse element, then the fuse can be reliably programmed, but the transistor size must be large and power consumption increases

Engineering Contradiction:
Improvefuse programming reliabilityVSAvoidprogramming current
Core Design Contradiction:
ReliabilityVSPower

Solution Approach 1:

The fuse element is segmented into two distinct portions: a first fuse portion made of silicide material and a second fuse portion made of non-silicide conductive material. This segmentation allows each portion to contribute differently to the programming process, enabling reliable fuse blowing at lower currents by utilizing the specific properties of each material segment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The fuse element employs composite materials by combining silicide material (first fuse portion) with non-silicide conductive material (second fuse portion). This composite structure leverages the high melting point and stability of silicide while using the lower melting point non-silicide material to facilitate blowing at reduced currents, thereby resolving the contradiction between reliability and power consumption.

Inventive Principle:
Principle #40Composite materials

2Reliability

If high programming current is used to blow out the fuse element, then the fuse can be reliably programmed, but the transistor size must be large

Engineering Contradiction:
Improvefuse programming reliabilityVSAvoidtransistor size
Core Design Contradiction:
ReliabilityVSArea of moving object

Solution Approach 1:

The fuse element is segmented into two distinct portions: a first fuse portion made of silicide material and a second fuse portion made of non-silicide conductive material. This segmentation allows each portion to contribute differently to the programming process, enabling reliable fuse blowing at lower currents by utilizing the specific properties of each material segment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The fuse element employs composite materials by combining silicide material (first fuse portion) with non-silicide conductive material (second fuse portion). This composite structure leverages the high melting point and stability of silicide while using the lower melting point non-silicide material to facilitate blowing at reduced currents, thereby resolving the contradiction between reliability and power consumption.

Inventive Principle:
Principle #40Composite materials

3Ease of manufacture

If conventional fuse structure is used, then the device can be manufactured with standard processes, but the cell size is large and power consumption is high

Engineering Contradiction:
Improvemanufacturing process compatibilityVSAvoidcell size
Core Design Contradiction:
Ease of manufactureVSArea of moving object

Solution Approach 1:

The invention changes the material parameters of the fuse element by introducing a dual-material structure with different melting points and electrical properties. This parameter change enables the fuse to achieve the same programming function with smaller dimensions and lower power consumption while remaining compatible with existing semiconductor manufacturing processes.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves a 70% reduction in cell size and 95% reduction in programming current, enabling high-density applications without area sacrifice and supporting low-power products.

Implementation Method 1

passing an electrical current of a sufficient magnitude to cause melting or agglomeration, thereby creating a more resistive path or an open circuit

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS8853079B2Fuse device
Publication Date: 2014.10.07 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US8853079B2 patent drawing
  • US8853079B2 patent drawing
  • US8853079B2 patent drawing

AI summary

A method of forming a device includes forming a silicon-containing line continuously extending between a first node and a second node. A first silicide-containing portion and a second silicide-containing portion are formed over the silicon-containing line. The first silicide-containing portion is separated from the second silicide-containing portion by a predetermined distance, and the predetermined distance is substantially equal to or less than a length of the silicon-containing line.