Segmented Silicon Electrode Ring for Dry Etching
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Solution Overview
Problem
The high cost of manufacturing silicon components for semiconductor dry etching apparatuses is due to the need for large-diameter silicon crystal ingots, which can be costly and inefficient.
Innovation Solution
A ring for an electrode is fabricated by joining multiple silicon members with eutectic alloy and silicon adhesion parts, allowing the use of smaller diameter silicon crystal ingots, reducing material waste and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a one-piece silicon component is used to ensure structural integrity and contamination prevention, then reliability is improved, but manufacturing cost increases due to requiring large-diameter silicon crystal ingots
Solution Approach 1:
The focus ring is divided into multiple silicon members (typically three) that are joined together to form the complete ring structure. Each silicon member can be manufactured from smaller-diameter silicon crystal ingots, eliminating the need for expensive large-diameter ingots while maintaining the functional integrity of the focus ring through proper joining techniques.
2Ease of manufacture
If multiple silicon members are joined together to reduce manufacturing cost, then ease of manufacture is improved, but structural integrity may deteriorate due to potential gaps or weak joints
Solution Approach 1:
A joining part consisting of eutectic alloy and silicon adhesion part is introduced as an intermediary between the silicon members. The eutectic alloy provides strong metallurgical bonding, while the silicon adhesion part ensures compatible thermal and mechanical properties with the silicon members, creating a joint that maintains structural integrity and prevents contamination.
3Ease of manufacture
If multiple silicon members are joined to use smaller ingots, then manufacturing cost is reduced, but contamination risk increases from the joining materials during plasma treatment
Solution Approach 1:
The joining part is constructed as a composite structure with eutectic alloy and silicon adhesion part. This composite design allows the joining part to provide strong bonding while the silicon adhesion component minimizes contamination during plasma treatment by being chemically compatible with the surrounding silicon structure.
Solution Approach 2:
The joining part is designed to be replaceable and not critical for long-term structural integrity compared to the main silicon members. If contamination occurs, only the joining part needs to be replaced rather than the entire focus ring, reducing operational costs and downtime.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of a silicon component ring using smaller silicon ingots, lowering manufacturing costs and preventing contamination from the eutectic alloy during plasma treatment.
Implementation Method 1
a joining part joining the plurality of first silicon members and the embedded silicon member, the joining part provided between the plurality of first silicon members and the embedded silicon member
Implementation Method 2
a silicon adhesion part plugging a gap between the plurality of silicon members
Data Source
AI summary
Provided is a ring for an electrode in which a plurality of silicon members is joined. The ring for the electrode includes a plurality of first silicon members abutted in one direction, an embedded silicon member that is embedded at a position across the plurality of first silicon members abutted, and a joining part joining the plurality of first silicon members and the embedded silicon member, the joining part provided between the plurality of first silicon members and the embedded silicon member.