Multi-die IC Assembly Using Segmented Silicon Interposer
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Solution Overview
Problem
Current 2.5D IC packaging is limited by the size of silicon interposers, which restricts the combination of large dies due to manufacturing constraints and increased costs associated with larger substrates, necessitating a method to accommodate larger package sizes using conventional photolithography technology.
Innovation Solution
The design involves a silicon interposer with an active area for TSVs and interconnects, allowing larger dies to be combined by aligning only portions of the dies over the active area, and using support structures to extend beyond the interposer periphery, enabling a larger package size while maintaining manufacturability with conventional technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the interposer substrate size is increased to accommodate larger dies or more dies, then the packaging capacity and functionality are improved, but the manufacturing cost increases and yield decreases due to specialized photolithography requirements
Solution Approach 1:
The patent divides the large interposer substrate into multiple smaller interposer substrates, each within the manufacturable size range. These segmented substrates are then assembled together to form the complete large-scale package, enabling both large area and conventional manufacturing processes to be utilized.
Solution Approach 2:
The patent transitions from a single-plane 2D arrangement to a multi-layer 3D configuration by stacking multiple interposer substrates vertically. This dimensional change allows the system to achieve large effective area through vertical integration rather than horizontal expansion, bypassing photolithography size limits.
2Adaptability or versatility
If the interposer substrate size is increased to accommodate larger dies, then the package size and die combination capability are improved, but the photolithography process becomes specialized and costly
Solution Approach 1:
The patent segments the interposer substrate into multiple smaller units that can each be manufactured using standard photolithography processes. This segmentation maintains adaptability for various die combinations while avoiding the need for complex specialized lithography equipment.
Solution Approach 2:
The patent performs preliminary assembly of multiple small interposer substrates before final die mounting. This preliminary structuring allows standard photolithography to be used for each small substrate while the overall system achieves the required versatility through pre-configured modular architecture.
3Quantity of substance
If multiple large flip-chip mounted dies are placed side by side on a single interposer substrate, then the functionality is improved, but the required interposer substrate size exceeds conventional manufacturing capabilities
Solution Approach 1:
The patent divides the package into multiple smaller interposer substrates, each capable of accommodating a manageable number of dies. This segmentation enables conventional manufacturing while achieving high die quantity through the assembly of multiple substrates.
Solution Approach 2:
The patent utilizes vertical stacking to arrange multiple interposer substrates in the third dimension, allowing a large number of dies to be packaged without requiring a single large horizontal substrate area. This 3D arrangement achieves high die density while maintaining manufacturable substrate sizes.
Data Source
Figure 1~3
Figure 2A~2B
AI summary
A multi-die integrated circuit assembly includes an interposer substrate larger than the typical reticle size used in fabricating the "active area" in which the through-silicon vias (TSVs) and interconnect conductors are formed in the interposer. At the same time, each of the dies has its external power/ground and I/O signal line connections concentrated into a smaller area of the die. The dies are disposed or mounted on the interposer such that these smaller areas (with the power/ground/IO connections) overlap with the active area of the interposer. In this configuration, a plurality of dies having a combined area substantially greater than the active area of the interposer can be mounted on the interposer (and take advantage of the active area for interconnections).