Segmented Land Design for Surface-Mounted Components
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Solution Overview
Problem
Existing land designs for surface-mounted components struggle to maintain stable soldering for components of different sizes, leading to issues like solder unjoining and component standing due to uneven solder distribution and force imbalances during the soldering process.
Innovation Solution
A land design featuring multiple land regions of varying widths, aligned in the width direction, with a cutout inhibition region on the side of the larger land region, allowing for self-alignment and stable soldering of components of different sizes by providing a controlled soldering dimension and preventing excessive solder flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a land shape is designed to be adaptable to different component sizes by combining land regions in a convex shape, then the land can accommodate multiple component sizes, but solder unjoining and component standing occur when small components are mounted due to long soldered portions and force imbalance
Solution Approach 1:
The land is divided into multiple land regions with different widths, where each land region corresponds to a specific component size. The land includes a first land region for a first component size and a second land region for a second component size, allowing the same land structure to accommodate different component sizes while maintaining appropriate solder joint lengths for each size category
Solution Approach 2:
Different portions of the land have different widths tailored to specific component sizes. The land width varies locally to match the electrode width of the mounted component, ensuring that small components have shorter soldered portions and large components have longer soldered portions, thereby optimizing solder joint stability for each component size
2Strength
If the land width is increased to accommodate large components, then large components can be mounted stably, but small components experience excessive solder flow and force imbalance toward the outer side
Solution Approach 1:
The land is segmented into multiple land regions with different widths, where the first land region has a width suitable for small components and the second land region has a width suitable for large components. This segmentation allows each region to provide appropriate mechanical support and solder joint characteristics for its intended component size
Solution Approach 2:
The land width is locally optimized for different component sizes. Small components are mounted on narrower land regions that prevent excessive solder flow and maintain force balance, while large components are mounted on wider land regions that provide sufficient support and stability
Data Source
AI summary
Provided is a land for a surface mounted component that includes a plurality of land regions respectively having different width. Land regions included in the plurality of land regions are combined with one another with centers in a width direction aligned in order conforming to the widths and are jointed into one land. A cutout shape is provided in a center in the width direction on a side opposed to an adjacent or overlapping side of a land region having a larger width of adjacent or partially overlapping two land regions in the plurality of land regions joined into the one land.