Segmented Spacer Elements for Hermetic Component Capsulation
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Solution Overview
Problem
Existing methods for manufacturing arrangements with components on carrier substrates face challenges in producing thin spacers efficiently, as fragile frame wafers are prone to breaking and require additional material and procedural steps, leading to increased costs and limitations in automatic handling.
Innovation Solution
A method involving the fabrication of spacer elements on the rear side of a cover substrate, where recesses are formed and the substrate is thinned to create open hollow spaces, allowing for the arrangement of components within these spaces, enabling the production of spacer elements with desired heights and configurations, such as 10 μm to 300 μm, and facilitating hermetic or quasi-hermetic capsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If frame wafers are used to create hollow spaces, then hollow spaces can be formed for component encapsulation, but the frame wafers are fragile and prone to breaking during handling
Solution Approach 1:
The patent divides the continuous frame wafer structure into individual separate spacer elements. Each spacer element is independently formed on the carrier substrate, eliminating the fragility of large continuous frame wafers while maintaining the hollow space formation capability. This segmentation allows each small spacer to be more robust and easier to handle individually.
Solution Approach 2:
The spacer elements are pre-formed on the carrier substrate before component placement. The hollow spaces are created in advance by forming recesses and covering them with spacer elements, allowing the structure to be prepared beforehand without requiring fragile frame wafers during the final assembly handling.
2Extent of automation
If continuous openings are provided in frame wafers, then hollow spaces are formed, but automatic handling with vacuum handlers becomes impossible
Solution Approach 1:
By segmenting the continuous frame wafer into separate spacer elements, each element can be individually positioned and handled. This allows vacuum handlers to grasp and manipulate discrete components rather than attempting to handle continuous structures with openings, enabling automated processing.
Solution Approach 2:
The patent introduces an intermediary adhesive layer that bonds the spacer elements to the carrier substrate. This adhesive intermediary allows the spacer elements to be securely attached during automated handling while still forming the required hollow spaces, bridging the gap between structural requirements and automation compatibility.
3Ease of operation
If temporarily bonded carrier wafers are used to circumvent handling issues, then automatic handling becomes possible, but additional material usage and procedural steps are required
Solution Approach 1:
The patent extracts the temporary carrier wafer concept and replaces it with permanent spacer elements formed directly on the final carrier substrate. By taking out the intermediate temporary carrier and using the actual carrier substrate itself to support the spacer elements, the design eliminates the need for additional temporary materials and their associated removal steps.
Solution Approach 2:
The carrier substrate and spacer element support structure are merged into a single integrated structure. The spacer elements are formed directly on the carrier substrate, combining the functions of the carrier and the spacer support into one component, thereby eliminating the need for separate temporary carrier wafers and reducing material usage.
4Length of stationary object
If thin spacer elements are manufactured, then desired low heights (10 μm to 300 μm) are achieved, but manufacturing precision and reliability become more difficult
Solution Approach 1:
The patent applies different properties to different parts of the spacer element structure. The spacer elements have localized thickness variations and are formed with specific geometric features that provide structural reinforcement at critical locations while maintaining the overall thin profile. This local quality approach allows thin spacers to achieve the desired low heights while maintaining manufacturing precision and reliability.
Data Source
AI summary
An arrangement including a carrier substrate, and a component situated on a cover surface of the carrier substrate in a hollow space, and electrical contacts for the component, wherein the hollow space is comprised of a plurality of spacer elements arranged on the cover surface of the carrier substrate and a cover substrate mounted on the plurality of spacer elements is provided. A semi-finished product comprising a carrier substrate made of silicon, wherein one or more recesses are formed on one side of the carrier substrate, and wherein the semi-finished product further comprises an alkaline evaporated glass applied to the side of the carrier substrate having the one or more recesses is also provided.