Spin Chuck Wafer Cleaning With Segmented Support and Guided Clamping
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Solution Overview
Problem
Existing semiconductor wafer processing tools are inadequate in efficiently managing the cleaning process, leading to issues such as excessive waste of processing liquids and inconsistent film thickness, which affects manufacturing efficiency and product yield.
Innovation Solution
A cleaning apparatus utilizing a spin chuck with chuck pins featuring a guiding member on the clamping member and a recessed segment on the supporter, which reduces contact area and minimizes liquid wastage, along with a method that includes securing the wafer with a clamping member, dispensing and heating a processing liquid, and removing it with a gas to maintain precise film thickness and control liquid flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If a conventional spin chuck with full contact support is used to hold the wafer, then the wafer is securely held during processing, but the processing liquid flows along the narrow space between the wafer and the support, causing excessive liquid wastage
Solution Approach 1:
The support surface is segmented into discrete support points (first support point and second support point) rather than a continuous support surface. This segmentation creates controlled narrow spaces that prevent processing liquid from flowing along the entire contact perimeter, thereby reducing liquid wastage while maintaining sufficient wafer holding stability through strategic support point placement.
Solution Approach 2:
Different regions of the support structure are given different functions: the first support point provides primary mechanical support, the second support point provides additional stability, and the narrow spaces between them are designed to control liquid flow. This local differentiation of support functions allows the system to reduce liquid wastage in critical areas while maintaining overall wafer holding reliability.
2Manufacturing precision
If processing liquid is dispensed over the wafer surface, then cleaning and film formation are achieved, but the liquid thickness becomes inconsistent, affecting manufacturing precision
Solution Approach 1:
The support structure segments the liquid flow path into controlled channels between support points. This segmentation ensures that processing liquid is distributed in a more uniform manner across the wafer surface, preventing pooling and thinning variations, thereby improving film thickness uniformity while optimizing liquid consumption by directing flow only where needed.
Solution Approach 2:
The support points are arranged in a specific spatial configuration that controls liquid flow in the radial dimension during wafer rotation. This dimensional control of liquid distribution ensures consistent film thickness across the wafer surface by maintaining uniform liquid supply in the radial direction, improving manufacturing precision.
3Loss of substance
If the wafer is held with a large contact area on the support, then the wafer is stable during spinning, but the processing liquid flows more easily along the contact region, increasing liquid wastage
Solution Approach 1:
The contact area is segmented into discrete support points rather than a continuous large contact region. This segmentation reduces the total perimeter along which liquid can flow off the wafer, thereby reducing liquid wastage. The support points are strategically positioned to maintain adequate rotational stability during wafer spinning despite the reduced contact area.
Solution Approach 2:
The support structure is designed to adapt to the dynamic conditions of wafer rotation. The narrow spaces between support points are optimized to maintain liquid flow control during spinning, allowing the system to reduce liquid wastage while maintaining rotational stability through dynamic balance of the support point configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces liquid wastage, maintains precise processing liquid film thickness, and enhances product yield by controlling the contact area and flow of liquids during the cleaning process, thereby improving manufacturing efficiency.
Implementation Method 1
spinning the semiconductor wafer by rotating the spin base about the central axis
Implementation Method 2
heating the semiconductor wafer with the thermal plate
Implementation Method 3
removing it with a gas
Data Source
AI summary
A method for cleaning a semiconductor wafer is provided. The method includes placing a semiconductor wafer over a supporter arranged around a central axis of a spin base. The method further includes securing the semiconductor wafer using a clamping member positioned on the supporter. The movement of the semiconductor wafer during the placement of the semiconductor wafer over the supporter is guided by a guiding member located over the clamping member. The method also includes spinning the semiconductor wafer by rotating the spin base about the central axis. In addition, the method includes dispensing a processing liquid over the semiconductor wafer.