Segmented Metal Oxide Sputtering Target for Uniform Thin Films
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Solution Overview
Problem
As display devices become larger, the sputtering process requires improved uniformity of thin films to ensure quality and performance, which existing sputtering targets fail to achieve consistently.
Innovation Solution
A sputtering target with a structure comprising a first target part, a second target part, and a target dividing part, all made of metal oxides, where the target dividing part includes the same metal element as the first and second target parts, allowing for improved uniformity and reduced non-uniform sputtering stains.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional sputtering target is used, then the sputtering process can be performed, but the uniformity of the deposited thin film deteriorates due to non-uniform sputtering stains
Solution Approach 1:
The sputtering target is divided into multiple target parts (first target part, second target part, third target part) arranged in parallel. Each target part is independently sputtered, allowing for more uniform material deposition across the substrate surface. The target dividing parts separate these target parts, ensuring consistent spacing and sputtering conditions for each segment, which collectively improves thin film uniformity and reduces non-uniform stains.
Solution Approach 2:
Target dividing parts are introduced as intermediary structures between the target parts. These dividing parts include the same metal element as the target parts and serve as mediators that maintain consistent spacing and electrical connection while preventing direct contact between target parts. This intermediary structure ensures uniform sputtering conditions and eliminates the harmful non-uniform stains caused by improper target configuration.
2Manufacturing precision
If the target parts are spaced apart to improve uniformity, then the thin film uniformity improves, but the structural complexity increases
Solution Approach 1:
Multiple target parts are merged into a single integrated sputtering target assembly that functions as one coherent structure. The target parts and target dividing parts are electrically connected and mechanically integrated, allowing the complex multi-part structure to operate simplistically as a unified sputtering source. This merging approach maintains structural complexity while achieving improved uniformity through the coordinated action of multiple target parts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed sputtering target design enhances the uniformity of thin films deposited on substrates, improving the process quality of the sputtering process and the performance of oxide transistors, which in turn enhances the performance of display devices.
Implementation Method 1
The sputtering process has the advantage of easily obtaining the thin film regardless of the material of the substrate, and is widely used in the manufacturing process of the display device.
Implementation Method 2
Methods for forming the thin films include chemical vapor deposition (CVD) and physical vapor deposition (PVD).
Data Source
AI summary
A sputtering target includes a first target part and a second target part both including a metal oxide and adjacent to each other and a target dividing part disposed between a first target part and a second target part. The target dividing part includes a same metal element as a metal element included in a first target part and a second target part. Therefore, size and/or length of the sputtering target may be increased. Thus, efficiency of a manufacturing process of the sputtering target is improved and a manufacturing cost is reduced. In addition, even after a thin film is deposited on a target substrate using the sputtering target, stains caused by sputtering of non-uniform amounts of metal elements by location on the target substrate do not occur on a target substrate. In addition, the uniformity of a thin film deposited on a target substrate is secured by using the sputtering target. Thus, process quality of a sputtering process is improved.