Segmented Stiffener Ring for Semiconductor Package Warpage Control
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Solution Overview
Problem
Semiconductor packages face challenges with warpage due to the placement of stiffeners, which can lead to signal loss and integrity issues, especially in high-speed applications like 200G SerDes devices, as conventional stiffener arrangements restrict the placement of additional components and increase the likelihood of warpage, affecting electrical contact and signal transmission.
Innovation Solution
A semiconductor package design featuring a stiffener with an inner portion surrounding the chip and leg portions extending outwardly from the corners and sides, providing additional structural support and space for components while maintaining flatness, thereby reducing warpage and accommodating additional components like cable connectors on the package substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional stiffener arrangement is used, then structural support is provided, but warpage increases and component placement is restricted
Solution Approach 1:
The stiffener is segmented into an inner portion surrounding the chip and multiple leg portions extending outwardly. This segmentation allows the stiffener to provide structural support while reducing warpage by distributing stress across multiple discrete elements rather than a single continuous structure.
Solution Approach 2:
Different portions of the stiffener have different geometries and functions: the inner portion provides chip support while the leg portions extend toward package edges to control warpage. This local differentiation optimizes the stiffener's performance in different regions of the package.
2Strength
If a conventional stiffener arrangement is used, then structural support is provided, but additional component placement is restricted
Solution Approach 1:
By segmenting the stiffener into an inner portion and separate leg portions, the design creates open spaces between the leg portions where additional components can be placed. This maintains structural support functionality while increasing adaptability for component placement.
3Stability of the object's composition
If the stiffener extends close to package edges, then warpage is reduced, but space for additional components is reduced
Solution Approach 1:
The segmented stiffener structure with leg portions creates defined spaces between the legs where components can be placed, rather than having a continuous stiffener extending to all package edges. This segmentation maintains flatness control while preserving usable area.
Solution Approach 2:
The stiffener provides local support at critical areas (inner portion around chip and leg portions near edges) rather than continuous support across the entire package. This localized approach maintains flatness where needed while leaving spaces available for components.
Data Source
AI summary
A semiconductor package includes a package substrate, a semiconductor chip disposed on the package substrate, and a stiffener disposed on the package substrate. The stiffener includes an inner portion configured to surround the semiconductor chip, the inner portion defining a space on the package substrate external to the inner portion and located between the inner portion and outer edges of the package substrate, and a plurality of leg portions extending outwardly from the inner portion toward one or more of the outer edges of the package substrate and corners of the package substrate.