Segmented Substrate Frame Layout for 3D Stack Warpage Relief
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Solution Overview
Problem
3D stacked electronic assemblies experience mechanical stresses and warpage due to the rigid continuous substrate frame, which can lead to manufacturing failures and reliability issues.
Innovation Solution
The substrate frame is divided into a plurality of frame sections separated by spaces, allowing for expansion and contraction of substrates in response to temperature variations and reducing stress on the substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a rigid continuous substrate frame is used to provide structural support, then mechanical strength is improved, but stress and warpage on substrates increase
Solution Approach 1:
The substrate frame is divided into multiple frame sections separated by spaces, transforming the rigid continuous structure into a segmented one. This segmentation allows each frame section to independently accommodate substrate expansion and contraction, reducing stress transmission while maintaining overall structural support.
Solution Approach 2:
The frame sections are designed to be movable relative to each other through the spaces between them, allowing the structure to dynamically adapt to thermal expansion and contraction. This dynamic capability enables the frame to maintain support function while accommodating dimensional changes without generating excessive stress.
2Stability of the object's composition
If a continuous substrate frame is used to maintain structural integrity, then stability is improved, but adaptability to temperature variations deteriorates
Solution Approach 1:
By segmenting the continuous frame into multiple frame sections with spaces between them, the structure gains the ability to adapt to temperature variations. Each section can move independently within the spaces, allowing the overall structure to expand and contract with temperature changes while maintaining structural integrity through the interconnected frame sections.
Solution Approach 2:
The segmented frame structure acts as a flexible support system, where the spaces between frame sections provide the flexibility needed to accommodate thermal expansion and contraction. This flexibility allows the frame to adapt to temperature variations while still providing the necessary structural support for the substrates.
3Reliability
If frame sections are separated by spaces to reduce stress, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The segmentation into frame sections with spaces between them improves reliability by reducing stress on substrates, preventing warpage and manufacturing failures. While this increases structural complexity, the modular nature of the segmented frame can simplify manufacturing and assembly processes compared to a monolithic continuous frame that would require higher precision to prevent stress-related failures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces warpage and stress on the substrates, improving the reliability and manufacturing efficiency of 3D stacked electronic assemblies.
Implementation Method 1
allowing for expansion and contraction of substrates in response to temperature variations
Data Source
AI summary
In order to relieve the stress on the substrates in a 3D stacked electronic assembly, a substrate frame is divided into a plurality of frame sections that are separated by spaces between the frame sections. These separations allow the substrates to expand/contract in response to temperature variations and other environmental conditions, and generally allow the substrates to move in one or more axial directions. The separations between the substrate portions are design-specific for each substrate design. The placement of IC packages on either side of the substrate is analyzed to identify areas of maximal warpage through physical measurements, physical model simulations, or using a trained neural network. The spaces in the substrate frame are then be placed next to or aligned with the areas of maximal warpage to reduce the stress on the substrate.