Segmented Substrate Holder for Bonding Distortion Control
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Solution Overview
Problem
Existing substrate bonding apparatuses face challenges in uniformly and efficiently bonding substrates due to uneven pressure distribution and distortion during the bonding process, leading to inconsistencies in the bonding quality.
Innovation Solution
A substrate processing apparatus with a holder featuring an outer and inner attracting member configuration, controlled by a moving device and a controller, to manage substrate distortion and ensure uniform bonding by adjusting the attracting pressure in different regions of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single attracting member is used to hold the substrate, then the device complexity is reduced, but the manufacturing precision deteriorates due to anisotropy-induced distortion
Solution Approach 1:
The attracting member is divided into multiple independent attracting regions (first, second, third, and fourth attracting members) that can be controlled separately. Each attracting member corresponds to a different directional axis, allowing independent control of stress application in various directions to compensate for anisotropy-induced distortion during substrate bonding.
Solution Approach 2:
Different attracting members are assigned different attraction forces based on the anisotropy characteristics of the substrate. The controller adjusts the attraction force of each attracting member individually to counteract distortion in specific directions, applying localized quality control to achieve uniform bonding precision across the substrate.
2Manufacturing precision
If the outer attracting member is moved relative to the inner attracting member, then the distortion control capability is improved, but the device complexity increases
Solution Approach 1:
The outer attracting member is designed to be movable relative to the inner attracting member in the diametrical direction, transforming a static structure into a dynamic one. The moving device enables real-time adjustment of the outer attracting member's position to control substrate distortion during bonding, while the controller automates this movement to manage device complexity.
Solution Approach 2:
The controller monitors the substrate bonding process and adjusts the position of the outer attracting member relative to the inner attracting member based on detected distortion. This feedback mechanism enables precise distortion control while automating the complex moving device operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise control over the bonding process, resulting in consistent and high-quality bonding of substrates by minimizing distortion and ensuring uniform pressure distribution across the substrate surface.
Implementation Method 1
a bonding apparatus brings a central portion of the upper substrate attracted by the upper chuck into contact with a central portion of the lower substrate attracted by the lower chuck
Data Source
AI summary
A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.