Segmented Substrate Processing Chamber for Deposition and Etching
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Solution Overview
Problem
Existing substrate treating apparatuses face challenges in efficiently performing deposition and etching processes with high aspect ratio patterns due to temperature changes causing part damage, contamination, and increased process time, especially when separate chambers are used, leading to space inefficiency and environmental disruptions.
Innovation Solution
A substrate treating apparatus with a chamber divided into multiple treating spaces and a transfer space, using a movable separation unit to separate and combine these spaces for simultaneous deposition and etching processes, minimizing temperature changes and contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a deposition process and an etching process are performed in the same chamber using a same substrate support unit, then the apparatus size is reduced and space utilization is improved, but the chamber parts are damaged by heat shock due to temperature conversion and the usage life is reduced
Solution Approach 1:
The single chamber is segmented into a deposition chamber and an etching chamber using a partition wall. This allows each chamber to maintain its own optimal temperature independently, eliminating heat shock damage to parts while still using a compact single-chamber design. The partition wall creates separate thermal zones within the same apparatus boundary.
Solution Approach 2:
Different regions of the chamber (deposition chamber and etching chamber) are given different temperature characteristics suitable for their specific processes. The deposition chamber can be heated to higher temperatures while the etching chamber maintains lower temperatures, allowing each process to occur under optimal local conditions without affecting the other.
2Adaptability or versatility
If temperature is converted between processes in the same chamber, then process flexibility is improved, but contaminants are generated due to gas condensation and the substrate is contaminated
Solution Approach 1:
The chamber is divided into separate deposition and etching chambers, preventing condensation of remaining gas from affecting the substrate during temperature transitions. Each chamber can undergo temperature changes independently without contaminating the other, eliminating the contamination issue while maintaining process flexibility.
Solution Approach 2:
The partition wall acts as an intermediary barrier between the deposition and etching chambers. It prevents the direct interaction of gases and contaminants between chambers during temperature conversion, allowing each chamber to maintain its own clean environment while still enabling flexible process sequencing.
3Adaptability or versatility
If temperature conversion is performed between deposition and etching processes, then process adaptability is improved, but the process time increases due to temperature conversion and stabilization time
Solution Approach 1:
By segmenting the chamber into separate deposition and etching chambers with independent temperature control, each chamber can maintain its optimal temperature continuously. This eliminates the need for temperature conversion and stabilization time between processes, reducing overall process time while maintaining full process adaptability.
Solution Approach 2:
The separate chambers allow continuous useful action by maintaining optimal temperatures for both deposition and etching processes simultaneously or in sequence without interruption. The deposition chamber can be heated while the etching chamber maintains its temperature, eliminating idle time during process transitions.
4Productivity
If a multi-stage type treats multiple substrates in one chamber, then productivity is improved, but the robot transferring the substrate is contaminated and generates contaminants
Solution Approach 1:
The chamber is segmented into separate deposition and etching chambers, allowing substrates to be processed in sequence through different chambers. This reduces the need for extensive substrate transfer within a single chamber, minimizing robot contamination while maintaining productivity through efficient process sequencing.
Data Source
AI summary
The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having an inner space; a separation unit provided at the inner space and configured to be combined with the chamber to divide the inner space into a plurality of treating spaces and a transfer space; a plurality of support units provided at each of the plurality of treating spaces and configured to support a substrate; a plurality of gas supply units provided at each of the plurality of treating spaces and configured to supply a process gas to the substrate supported on the plurality of support units; and a transfer unit provided at the transfer space and configured to transfer the substrate between the plurality of treating spaces.