Segmented Semiconductor Substrates with Reconnection Layer

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Solution Overview

Problem

Semiconductor device packages with large substrate areas experience low manufacturing yield due to complex circuitry and increased substrate size, leading to higher costs.

Innovation Solution

The semiconductor package structure incorporates a first and second substrate separated by a gap, with a reconnection layer and redistribution layer to reconnect disconnected interconnection structures, ensuring a complete circuit function and improving yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the substrate area is increased to accommodate complex circuitry, then the circuit functionality is improved, but the manufacturing yield deteriorates

Engineering Contradiction:

Improvecircuit functionalityVSAvoidmanufacturing yield

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The substrate is divided into multiple smaller substrates that are processed separately and then reconnected through the redistribution layer, allowing each substrate to be manufactured with higher yield while maintaining overall circuit functionality

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The circuit layout is redistributed across multiple substrates arranged in a two-dimensional array, with interconnections extending into the vertical dimension through the redistribution layer, effectively solving the yield problem by distributing complexity across multiple dimensions

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If the substrate area is increased, then the circuit complexity is improved, but the manufacturing cost increases

Engineering Contradiction:

Improvecircuit complexityVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The large substrate is segmented into smaller substrates that can be manufactured more efficiently and at lower cost, then reconnected through the redistribution layer to achieve the required circuit complexity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple identical or similar substrate units are created through standardization, allowing for economies of scale in manufacturing while the redistribution layer provides the complex interconnections needed for high-level circuit functionality

Inventive Principle:

Principle #26Copying

Data Source

PatentUS11322471B2Semiconductor package structures, semiconductor device packages and methods of manufacturing the same

Publication Date: 2022.05.03 ADVANCED SEMICON ENG INC

AI summary

A semiconductor package structure includes a first substrate, a second substrate, a first redistribution layer, and a first reconnection layer. The first substrate may have a first surface. The second substrate can be spaced apart from the first substrate with a gap and may have a second surface. The first redistribution layer can be disposed between the first redistribution layer and the gap. The first substrate can be electrically connected to the second substrate via the first reconnection layer.