Segmented Semiconductor Substrate Package for Shorter Signal Paths
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Solution Overview
Problem
Integrating multiple components in a single electronic device package leads to signal distortion due to long electrical paths and requires larger carriers, decreasing yield and efficiency.
Innovation Solution
The electronic package incorporates a semiconductor substrate with integrated active and passive regions, where active regions regulate power signals and passive regions transmit data signals, reducing signal distortion and path length by embedding active elements directly within the substrate and using external connection elements to connect separate substrates, thereby improving electrical performance and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple components are integrated in a single device package, then multiple functions are achieved, but signal distortion occurs due to long electrical paths
Solution Approach 1:
The device package is segmented into multiple semiconductor substrates, each containing specific components. This segmentation reduces the electrical path lengths within each substrate while maintaining the functionality of multiple components through inter-substrate connections via wire bonds or solder bumps.
2Adaptability or versatility
If multiple components are integrated in a single device package, then multiple functions are achieved, but a relatively large carrier is required, decreasing yield
Solution Approach 1:
The device is divided into multiple smaller semiconductor substrates that can be manufactured independently on smaller carriers, improving manufacturing yield. These substrates are then assembled together to achieve the functionality of multiple components, avoiding the need for a single large carrier.
Solution Approach 2:
Multiple semiconductor substrates are stacked or arranged in a compact configuration, with smaller substrates positioned on or near larger ones. This nested arrangement reduces the overall carrier size required while accommodating multiple functional components.
3Reliability
If active elements are embedded directly within the substrate, then signal paths are shortened, but manufacturing complexity increases
Solution Approach 1:
Active elements such as power management ICs are merged directly into the semiconductor substrate, eliminating separate components and reducing electrical path lengths. This integration improves signal quality while the modular substrate design keeps manufacturing processes manageable through standardized integration techniques.
Data Source
AI summary
An electronic package is provided. The electronic package includes a semiconductor substrate. The semiconductor substrate includes a first active region and a first passive region separated from the first active region. The first active region is configured to regulate a power signal. The first passive region is configured to transmit a data signal.