Segmented Substrate Support Heating for Uniform Plasma Treatment
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Solution Overview
Problem
The challenge of securing treatment uniformity and efficiency for larger substrates with increasingly critical dimensions in semiconductor manufacturing processes, particularly in plasma-based substrate treatment, is exacerbated by the complexity of existing heating systems.
Innovation Solution
A supporting unit with independently controllable heating elements, each connected to unique power supply and return lines, allows for precise temperature control of different substrate areas, facilitated by a power supply module with switches and a controller to manage power distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple heating elements are used to control temperatures of different substrate areas, then treatment uniformity is improved, but device complexity increases due to connection structure requirements
Solution Approach 1:
The substrate heating system is segmented into multiple independent heating elements (first heating element, second heating element, third heating element) that can independently control temperatures of different substrate areas. Each heating element is electrically isolated with dedicated power supply and return lines, allowing independent temperature control to achieve uniform treatment across the substrate surface.
Solution Approach 2:
Different regions of the substrate receive customized heating through locally positioned heating elements. The first heating element controls a first area, the second heating element controls a second area, and the third heating element controls a third area, enabling each region to be optimized for its specific treatment requirements while maintaining overall uniformity.
2Reliability
If power supply lines and return lines are shared among heating elements, then device complexity is reduced, but operational reliability deteriorates due to inability to operate heating elements independently
Solution Approach 1:
The electrical connection system is segmented into separate power supply lines and return lines for each heating element. The first power supply line connects only to the first heating element, the second power supply line connects only to the second heating element, and so on. This segmentation enables independent operation of each heating element, ensuring that if one element fails or needs maintenance, others can continue operating reliably.
3Productivity
If substrate diameter is enlarged to increase processing capacity, then productivity is improved, but treatment uniformity deteriorates due to difficulty in maintaining consistent treatment across larger area
Solution Approach 1:
The heating system is divided into multiple spatially distributed heating elements positioned across the substrate surface. This segmentation allows each heating element to independently manage temperature in its local region, maintaining uniform treatment across the entire enlarged substrate area by compensating for variations in heat distribution across different zones.
Solution Approach 2:
Each heating element provides localized temperature control tailored to its specific region of the substrate. This local quality approach ensures that even as substrate diameter increases, each area receives optimized heating conditions, preventing temperature gradients and maintaining consistent treatment uniformity across the entire substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances treatment uniformity and efficiency by enabling independent heating of substrate areas without a complex connection structure, ensuring consistent and uniform treatment across larger substrates.
Implementation Method 1
heating elements provided to the plate and controlling a temperature of a substrate
Data Source
AI summary
Provided is a supporting unit supporting a substrate. The supporting unit may include: a plate; heating elements provided to the plate and controlling a temperature of a substrate, wherein the heating elements are arranged to control temperatures of different areas of the substrate; and a power supply module supplying power to the heating element, and the power supply module may be configured to continuously supply the power to at least two heating elements of the heating elements.