Segmented Substrate Support Pin for Thermal Expansion Management
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in maintaining in-plane uniformity of substrate temperature and preventing breakage of substrate support pins due to thermal expansion or shrinkage, which can cause positional deviations and tilting of pins, leading to impaired operation and potential damage.
Innovation Solution
A substrate processing apparatus with a stage having through-holes and substrate support pins composed of separate first and second members, where the second member has a sliding surface on the first member and a flange portion below the stage, allowing for vertical movement and engagement with a pin support member to prevent tilting and stress on the pins, thus maintaining uniformity and preventing breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the substrate support pin is made as a single integral body, then the structure is simple, but the pin cannot accommodate thermal expansion or shrinkage, causing positional deviations and tilting
Solution Approach 1:
The substrate support pin is divided into two separate members: a first member with a flange portion and a second member with an insertion portion. This segmentation allows each member to independently accommodate thermal expansion or shrinkage, preventing positional deviations and tilting while maintaining operational reliability.
Solution Approach 2:
The sliding surface between the first and second members enables dynamic adjustment during thermal cycles. The members can move relative to each other along the sliding surface, allowing the pin structure to adapt to thermal expansion and contraction without compromising reliability.
2Stability of the object's composition
If the substrate support pin is fixed rigidly to the stage, then the pin position is stable, but thermal expansion causes tilting and stress on the pin
Solution Approach 1:
The pin structure transitions from rigid fixation to a dynamic configuration where the first and second members can slide relative to each other. This allows the pin to maintain positional stability through the engagement of the flange portion with the pin support member while accommodating thermal expansion through the sliding mechanism, preventing stress concentration and tilting.
Solution Approach 2:
The sliding surface acts as an intermediary between the first and second members, enabling relative movement to accommodate thermal expansion while maintaining the overall stability of the pin structure through the flange portion's engagement with the pin support member.
3Manufacturing precision
If the through-hole diameter is reduced to improve temperature uniformity, then in-plane temperature uniformity improves, but the pin cannot be properly supported
Solution Approach 1:
The solution moves the support function from the through-hole dimension to a lower dimension by introducing the flange portion below the stage. This allows the through-hole to be smaller for improved temperature uniformity while the flange portion provides reliable support through engagement with the pin support member.
Solution Approach 2:
The pin structure is segmented into portions above and below the stage, with the flange portion positioned below to engage with the pin support member. This segmentation allows the through-hole to be minimized for thermal uniformity while maintaining pin support reliability through the flange engagement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves in-plane temperature uniformity and prevents breakage of substrate support pins, ensuring smooth operation and efficient substrate processing by accommodating thermal expansion and maintaining pin alignment.
Implementation Method 1
preventing breakage of substrate support pins due to thermal expansion or shrinkage
Data Source
AI summary
A substrate processing apparatus includes: a stage for performing at least one of heating and cooling on a substrate placed thereon and having a through-hole vertically penetrating the stage; a substrate support pin having an insertion portion inserted into the through-hole and configured so that the insertion portion protrudes from an upper surface of the stage through the through-hole; and a pin support member for supporting the substrate support pin. The substrate support pin has a flange portion located below a lower surface of the stage. The support member supports the substrate support pin by engagement with the flange portion. The through-hole is smaller than the flange portion. The substrate support pin includes a first member including the flange portion and a second member having the insertion portion. The first member has a sliding surface which slidably supports the second member.