Segmented Induction Substrate Layout for Thin Wireless Transmission Modules
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Solution Overview
Problem
Existing wireless transmission modules face challenges in achieving better charging and communication performance while maintaining a thin profile and minimizing thickness, electromagnetic interference, and ensuring mechanical strength and heat dissipation efficiency.
Innovation Solution
A wireless transmission module design featuring a coil assembly and an induction substrate with a specific configuration of blocks and gaps that alter electromagnetic field distribution, combined with protection elements and an adhesive assembly for enhanced mechanical strength and efficiency, and a pressing process to increase flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a magnetically conductive substrate is used to support the coil, then magnetic field concentration is improved, but device thickness increases
Solution Approach 1:
The induction substrate is divided into multiple blocks (first block, second block, third block, fourth block) separated by gaps. This segmentation allows the magnetic field to be concentrated at specific locations while reducing the overall thickness of the substrate, resolving the contradiction between field concentration and thickness reduction.
Solution Approach 2:
Different regions of the induction substrate have different properties - the blocks provide magnetic conductivity for field concentration, while the gaps reduce overall thickness. This local differentiation allows simultaneous achievement of both magnetic field concentration and thin profile.
2Productivity
If the coil is tightly wound to improve charging efficiency, then electromagnetic interference increases
Solution Approach 1:
Gaps are extracted from the continuous induction substrate structure, creating separated blocks. This extraction reduces electromagnetic interference by breaking up continuous magnetic paths while maintaining charging efficiency through strategic placement of conductive blocks.
3Strength
If protection elements are added to protect the induction substrate, then mechanical strength is improved, but device complexity increases
Solution Approach 1:
The protection element is merged with the induction substrate through adhesive assembly, creating an integrated protective structure. This combining approach provides mechanical protection while minimizing the increase in overall device complexity.
4Length of stationary object
If the induction substrate is made thinner to reduce device thickness, then mechanical strength decreases
Solution Approach 1:
The thin induction substrate is segmented into multiple blocks connected by gaps. This segmentation allows the substrate to maintain thin profile while the block structure provides enhanced mechanical strength compared to a continuous thin layer.
Solution Approach 2:
The induction substrate combines magnetic conductive material with adhesive material in a composite structure. This composite approach maintains thin thickness while improving mechanical strength through the combined properties of different materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves mechanical strength, charging efficiency, heat dissipation, miniaturization, and weight reduction while reducing electromagnetic interference and protecting the induction substrate from damage.
Implementation Method 1
the wireless charging receiving terminal in the electronic device generates current via electromagnetic induction or electromagnetic resonance
Implementation Method 2
the magnetically conductive substrate can concentrate the magnetic lines of force emitted from the coil for better performance
Data Source
AI summary
A wireless transmission module for transmitting energy or signals includes a coil assembly and an induction substrate. The coil assembly has a winding axis, and the induction substrate corresponds to the coil assembly. The induction substrate has a first surface facing the coil assembly.