Segmented Support Member for Micro LED Compression Bonding
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Solution Overview
Problem
The manufacturing process of light source modules, particularly with ultra-compact micro LEDs, requires high precision to prevent deformation and accurate arrangement, which is challenging due to the small size and delicate nature of these components.
Innovation Solution
A compression bonding apparatus with a stage, support member, and pressing member is used to precisely attach light emitting devices to a substrate, where the support member surrounds the substrate and has varying heights to ensure uniform pressure distribution and prevent deformation, and the pressing member descends to press the devices while maintaining parallel contact to ensure accurate positioning and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional compression bonding apparatus is used to attach micro LEDs to a substrate, then the bonding process can be completed, but the precision of attachment and arrangement deteriorates due to the small size and delicate nature of micro LEDs
Solution Approach 1:
The support member is divided into multiple segments corresponding to different regions of the substrate. Each segment can be independently adjusted in height to provide localized support and pressure distribution, enabling precise control over the bonding process for different areas of the substrate simultaneously
Solution Approach 2:
Different regions of the support member are designed with different heights to match the local topography and requirements of the substrate. This allows each region to provide optimized support characteristics tailored to the specific bonding needs of that area, improving overall attachment precision
2Stability of the object's composition
If uniform pressure is applied during compression bonding, then the bonding process is simple, but the arrangement and disposition of micro LEDs may be deformed due to non-uniform pressure distribution
Solution Approach 1:
The support member heights are adjustable and can be dynamically modified based on the measured pressure distribution. This allows the system to adapt in real-time, transforming a static uniform pressure approach into a dynamic compensated pressure distribution that maintains arrangement stability
Solution Approach 2:
The system measures the actual pressure distribution during bonding and uses this feedback information to adjust the support member heights. This closed-loop control ensures that the pressure distribution is corrected to achieve uniform bonding pressure, preventing deformation of micro LED arrangements
3Manufacturing precision
If the support member has fixed height, then the device structure is simple, but it cannot compensate for pressure distribution variations across the substrate
Solution Approach 1:
The support member is segmented into multiple independently adjustable sections, each capable of having its height modified. This segmentation enables localized compensation for pressure distribution variations across different regions of the substrate without requiring complete redesign of the entire support structure
Solution Approach 2:
The height parameter of the support member is made variable rather than fixed. By changing the height parameter of different support segments, the system can compensate for pressure distribution variations and achieve uniform bonding pressure across the substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for precise and reliable attachment of micro LEDs to the substrate, maintaining their correct position and ensuring uniform pressure distribution, resulting in a high-reliability light source module with improved precision and reliability.
Implementation Method 1
a compression bonding apparatus including: a stage configured to support a substrate on which a plurality of light emitting devices are arranged on an adhesive layer having a predetermined viscosity; a support member disposed on the stage and surrounding at least a part of a side surface of the substrate; and a pressing member configured to press the plurality of light emitting devices
Data Source
AI summary
A compression bonding apparatus is disclosed. The compression bonding apparatus comprises: a stage configured to support a substrate on which a plurality of light emitting elements are arranged on an adhesive layer having a predetermined viscosity; a support member disposed on the stage and surrounding at least a part of a side surface of the substrate; and a pressing member configured to press the plurality of light emitting elements, wherein the support member is configured to have a height equal to or greater than the height of the substrate.