Thermally Segmented Test Tray for High-Temperature PIC Testing
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Solution Overview
Problem
Current testing methods for photonics integrated circuits (PIC) either expose optical connectors to suboptimal temperatures or require elongated optical fibers, leading to inefficiencies and potential damage during high-temperature testing.
Innovation Solution
A test tray system with a first section for exposing PIC modules to high temperatures and a second section covered by a thermal protection element to shield optical connectors from these temperatures, using thermal insulation and optional cooling systems to maintain component integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the optical connector is exposed to high temperature (125°C) during PIC module testing, then the PIC module reliability is improved, but the optical connector may be damaged or malfunction
Solution Approach 1:
The test tray is divided into two distinct sections: a first section that exposes the PIC module to high temperature (125°C) and a second section that thermally protects the optical connector. This segmentation allows different thermal environments to be applied to different components simultaneously, resolving the contradiction between testing the PIC module at high temperature and protecting the optical connector from thermal damage.
Solution Approach 2:
A thermal protection element (such as a heat shield or insulating barrier) is introduced as an intermediary between the high-temperature testing environment and the optical connector. This intermediary component blocks or reduces heat transfer to the optical connector, allowing the PIC module to be tested at 125°C while keeping the optical connector at safe temperatures.
2Object-affected harmful factors
If the optical connector is placed outside the testing chamber and connected with a long optical fiber, then the optical connector is protected from high temperature, but the device complexity and testing efficiency deteriorate
Solution Approach 1:
The test tray is segmented into two sections within a single chamber: the first section for high-temperature PIC module testing and the second section for thermally protected optical connector placement. This eliminates the need for external placement and long optical fibers, reducing system complexity while maintaining thermal protection.
Solution Approach 2:
The testing chamber is designed to accommodate both the high-temperature testing zone and the thermally protected zone for the optical connector within a single integrated system. This merging of functions allows simultaneous testing and protection without requiring separate chambers or external connections, simplifying the overall testing system.
3Object-affected harmful factors
If the maximum testing temperature is limited to 85°C to protect the optical connector, then the optical connector is protected, but the PIC module reliability testing is compromised
Solution Approach 1:
The testing system is segmented into two thermal zones: a first section where the PIC module is exposed to 125°C for proper reliability testing, and a second section where the optical connector is thermally protected at lower temperatures. This segmentation enables both components to operate within their respective optimal temperature ranges simultaneously.
Solution Approach 2:
Different thermal conditions are applied to different parts of the system: the PIC module receives high temperature (125°C) exposure for reliability testing, while the optical connector receives thermal protection (lower temperature). This local differentiation of thermal quality allows each component to be treated according to its specific requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable high-temperature testing of PIC modules while protecting optical connectors, reducing mechanical stress and maintaining connector functionality.
Implementation Method 1
a second section covered by a thermal protection element configured to prevent a second component from being exposed to the high temperature
Data Source
AI summary
A test tray system for electronics, like photonics integrated circuit (PIC) structures, and a related method are disclosed. The test tray system includes at least one test tray. Each test tray includes a first section exposing a first electrical component to a high temperature, and a second section covered by a thermal protection element configured to prevent a second component from being exposed to the high temperature at the same time that the first electrical component is being exposed to the high temperature. The test tray system allows testing of the first component at a high temperature, e.g., 125° C., while protecting the second component from the high temperatures.