Segmented Thermal Conductive Layer for Semiconductor Package Alignment
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Solution Overview
Problem
The alignment and height consistency between thermal interface materials (TIM) and thermal dissipation structures in semiconductor package devices are challenging due to coefficient of thermal expansion (CTE) mismatch, leading to potential delamination during temperature cycles.
Innovation Solution
A semiconductor package device with a thermal conductive layer comprising multiple spaced portions is used, which improves alignment and height consistency with the main board's thermal dissipation structure, reducing delamination risks by enhancing structural strength and preventing heat aggregation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a continuous thermal conductive layer is used, then heat dissipation is improved, but alignment with thermal dissipation structure and height consistency become difficult to achieve
Solution Approach 1:
The continuous thermal conductive layer is divided into multiple discrete thermal conductive portions, each corresponding to a specific heat-generating component. This segmentation enables precise alignment with thermal dissipation structures while maintaining effective heat dissipation pathways from each component.
2Temperature
If thermal interface material is used to connect semiconductor package device and main board, then heat dissipation is improved, but delamination occurs due to CTE mismatch during temperature cycles
Solution Approach 1:
The thermal interface material is segmented into discrete portions positioned between the thermal conductive portions and the main board. This segmentation reduces the total interface area subject to CTE mismatch stresses, thereby reducing delamination risk while maintaining thermal connectivity at critical heat dissipation points.
Solution Approach 2:
Different regions of the package device have different thermal and mechanical properties. The thermal conductive portions provide localized high thermal conductivity where heat dissipation is critical, while the spaced-apart configuration allows different CTE characteristics in different regions, accommodating thermal expansion differences during temperature cycling.
3Manufacturing precision
If thermal conductive layer has multiple spaced portions, then alignment and height consistency are improved, but heat aggregation may occur
Solution Approach 1:
Each thermal conductive portion is locally optimized to provide thermal conductivity where needed, with spacing that prevents heat aggregation while maintaining alignment precision. The discrete portions are positioned to match the thermal dissipation structure geometry, ensuring heat is conducted away from each heat-generating component without concentrating in unwanted regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances the alignment and height consistency between the thermal conductive layer and the main board, reducing delamination and improving the reliability of semiconductor package devices by addressing CTE mismatch issues.
Implementation Method 1
The flowable thermal conductive materials form a non-signal transmission region
Data Source
AI summary
A semiconductor package device includes a substrate, an electronic component, and a thermal conductive layer. The electronic component is disposed on the substrate and includes a first surface facing away from the substrate. The thermal conductive layer is disposed above the first surface of the electronic component. The thermal conductive layer includes a plurality of portions spaced apart from each other.