Segmented Thermal Diffuser for Wafer Holder Temperature Control
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Solution Overview
Problem
Existing electrostatic chucks in semiconductor processing face challenges in maintaining precise temperature control of wafers during high-heat processes, as they are subjected to rapid and wide temperature changes, requiring improved thermal management to achieve tight temperature tolerances.
Innovation Solution
A heating assembly with a diffuser layer and discrete diffuser segments separated by trenches, thermally decoupling heating zones to maintain a desired thermal gradient, enhancing temperature uniformity and control across the wafer surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heater is integrated in the electrostatic chuck to heat the wafer during processing, then the wafer can be heated to required processing temperatures, but rapid and wide temperature changes occur making it difficult to maintain tight temperature tolerances
Solution Approach 1:
The heating element is divided into multiple independent heating zones (e.g., inner heating zone and outer heating zone) that can be controlled separately. This segmentation allows different regions of the wafer to be heated to different temperatures or temperature rates, enabling precise temperature control and maintaining tight temperature tolerances during processing.
Solution Approach 2:
Different heating zones are assigned different thermal properties or control parameters to address local temperature requirements. The inner and outer heating zones can operate with different power levels, heating rates, or temperature setpoints, allowing localized temperature management to achieve uniform overall temperature control despite rapid temperature changes.
2Temperature
If multiple heating zones are used to improve temperature control, then temperature uniformity can be enhanced, but the device complexity increases
Solution Approach 1:
Multiple heating zones are integrated into a single heater component rather than using separate heater elements. The inner and outer heating zones are combined in one monolithic heater structure, which simplifies assembly and reduces device complexity while still providing independent temperature control capabilities for each zone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces temperature variation across the wafer surface, achieving improved process control during semiconductor processing by maintaining a consistent thermal gradient between heating zones, thereby ensuring precise temperature management.
Implementation Method 1
a heater attached to the diffuser layer
Implementation Method 2
The diffuser layer includes discrete diffuser segments separated by gaps. The discrete diffuser segments are made of the same material and are configured to allow a desired thermal gradient to be maintained between the discrete diffuser segments during heating of the target.
Data Source
AI summary
A heating assembly includes a support member for supporting a target thereon, a diffuser layer attached to the support member, and a heater attached to the diffuser layer. The diffuser layer includes discrete diffuser segments separated by gaps. The discrete diffuser segments are made of the same material and are configured to allow a desired thermal gradient to be maintained between the discrete diffuser segments during heating of the target.