Segmented Thermoelectric Cooling Module for Compact IC Thermal Management
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Solution Overview
Problem
The increasing complexity and heat generation of integrated circuits in compact electronic devices pose a challenge for cooling systems, requiring efficient heat absorption and dissipation in smaller, lighter form factors, which existing cooling systems struggle to achieve.
Innovation Solution
A thermoelectric module with independently controllable major and minor sections, each comprising multiple TEC units made of P-type and N-type semiconductors, allowing for flexible voltage control to optimize cooling efficiency across varying heat source power levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a cooling system is designed to dissipate tens of watts of power in a compact form factor, then the cooling efficiency is improved, but the system weight and size increase
Solution Approach 1:
The cooling system is divided into multiple independently controllable zones corresponding to different regions of the integrated circuit. Each zone has its own thermoelectric cooler units that can be selectively activated based on the heat generation profile of specific circuit regions, allowing efficient cooling without deploying the entire system at once.
Solution Approach 2:
The system dynamically adjusts the operation of different zones based on real-time heat generation patterns. By independently controlling each zone's thermoelectric cooler units, the system activates only the necessary cooling capacity required for current operating conditions, reducing overall system weight and power consumption while maintaining cooling efficiency.
2Volume of moving object
If the form factor of electronic devices is decreased, then the portability is improved, but the ability to dissipate heat from high-power processors deteriorates
Solution Approach 1:
The thermoelectric cooling module is segmented into multiple zones with independently controllable major and minor sections. This segmentation allows the system to provide targeted cooling to specific high-heat regions within a compact form factor, maintaining effective heat dissipation without increasing overall device volume.
Solution Approach 2:
Different zones of the cooling system are optimized for different thermal loads. The system applies localized cooling quality to specific regions of the integrated circuit based on their heat generation characteristics, enabling effective heat management in compact devices without requiring uniform cooling across the entire device.
3Device complexity
If a single-zone cooling system is used, then the device complexity is reduced, but the adaptability to different heat generation patterns deteriorates
Solution Approach 1:
The cooling system is divided into multiple independently controllable zones with major and minor sections. Each zone can be independently activated and adjusted based on the heat generation pattern of corresponding circuit regions, providing high adaptability while using simple on/off control logic for each zone.
Solution Approach 2:
The system activates only the necessary portions of the cooling system required for current operating conditions. By selectively enabling specific zones and adjusting their cooling capacity, the system achieves high adaptability to different heat patterns without requiring complex control mechanisms for the entire system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat transfer and management in compact electronic devices by allowing for high efficiency in low-power modes while maintaining effective cooling in higher power scenarios, balancing size, weight, and performance requirements.
Implementation Method 1
each TEC unit includes one or more P-type semiconductors and N-type semiconductors electrically connected in series by electrical contacts, the electrical contacts positioned to make thermal contact with a top header and a bottom header
Data Source
AI summary
A thermoelectric module for cooling a heat source includes multiple major sections, each major section including multiple minor sections. Each minor section includes one or more thermoelectric cooler (TEC) units including P-type and N-type semiconductors. Each major section also includes a single output terminal commonly connected to the minor sections, where the output terminal is configured to provide a same reference voltage signal to each of the minor sections. Each major section also comprises multiple input terminals, where each input terminal is separately connected to one of the minor sections and each input terminal is configured to provide a separate input voltage signal to each of the minor sections. The module also comprises a controller configured to independently control each reference voltage signal applied to each major section, and independently control each input voltage signal applied to each input terminal of each minor section within each major section.