Segmented TIM Layers for Multi-Chip Thermal Coupling Control
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Solution Overview
Problem
Conventional semiconductor packages face challenges in efficiently cooling high-performance chips due to insufficient thermal conductivity and thermal coupling between chips, leading to reduced operational reliability.
Innovation Solution
A semiconductor package design featuring a first thermal interface material (TIM) layer with lower thermal conductivity and second TIM layers with higher thermal conductivity, arranged to contact the chips and reduce thermal coupling, along with a heat dissipation device for efficient heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single TIM layer with high thermal conductivity is used to cool the chips, then heat dissipation efficiency is improved, but thermal coupling between adjacent chips increases
Solution Approach 1:
The TIM structure is segmented into multiple layers with different thermal conductivities. The first TIM layer has lower thermal conductivity to reduce thermal coupling between chips, while the second TIM layer has higher thermal conductivity to improve heat dissipation from each chip to the heat dissipation device, addressing both thermal management requirements simultaneously
Solution Approach 2:
Different regions of the TIM structure have different thermal conductivity properties tailored to local requirements. The first TIM layer provides thermal isolation between adjacent chips, while the second TIM layer provides efficient thermal conduction from each chip to the heat dissipation device, optimizing thermal performance locally
2Reliability
If a single TIM layer with low thermal conductivity is used to reduce thermal coupling, then thermal coupling between chips is reduced, but heat dissipation efficiency decreases
Solution Approach 1:
The TIM is divided into functional segments: the first TIM layer segment provides thermal isolation with lower thermal conductivity, while the second TIM layer segment provides heat dissipation with higher thermal conductivity, resolving the contradiction between thermal isolation and heat dissipation
Solution Approach 2:
The TIM structure uses composite material layers with different thermal conductivity properties. The combination of low thermal conductivity material (first TIM layer) and high thermal conductivity material (second TIM layer) creates a composite thermal management system that achieves both thermal coupling reduction and efficient heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances cooling efficiency by 8% and reduces thermal coupling by 4%, thereby increasing the operational reliability of the semiconductor package.
Implementation Method 1
Thermal conductivity of each of the second TIM layers is higher than that of the first TIM layer
Implementation Method 2
the first TIM layer is interposed between the second TIM layers
Data Source
AI summary
A semiconductor package is provided. The semiconductor package includes first and second semiconductor chips mounted on an interposer structure, an insulating filler covering sides of the first and second semiconductor chips, a first thermal interface material (TIM) layer arranged on the insulating filler, and second TIM layers arranged on the first and second semiconductor chips. The thermal conductivity of each of the second TIM layers is higher than that of the first TIM layer and the first TIM layer is between the second TIM layers.