Segmented Vacuum Platform for Parallel Die Detachment
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Solution Overview
Problem
Existing die-ejector apparatuses face limitations in throughput due to the need for sequential detachment of dies from adhesive films, which results in slower assembly times and reduced economic efficiency.
Innovation Solution
A die-ejector apparatus with a vacuum platform featuring independently extendable segments and multiple die gripper heads, allowing for parallel detachment of dies and skipping of empty or defective positions, thereby increasing throughput without repositioning the adhesive film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single vacuum platform with fixed segments is used, then the device complexity is low, but the productivity is limited due to sequential die detachment
Solution Approach 1:
The vacuum platform is divided into multiple independently extendable segments, each capable of being extended to push against the adhesive film at different attachment positions. This segmentation allows parallel detachment of multiple dies simultaneously, increasing throughput while maintaining manageable device complexity through modular design
Solution Approach 2:
The segments are designed to be independently extendable and retractable, transforming the static vacuum platform into a dynamic system. This dynamic capability enables selective extension of segments based on die positions, allowing parallel processing without requiring a completely complex reconfiguration of the entire device
2Loss of time
If the adhesive film is repositioned after each die removal, then the device complexity is low, but the loss of time increases due to repeated repositioning operations
Solution Approach 1:
By segmenting the vacuum platform into multiple independently controllable sections, the system can maintain the adhesive film in a fixed position while different segments are selectively extended to access and detach dies from various attachment positions simultaneously, eliminating repositioning time
Solution Approach 2:
The vacuum platform is pre-configured with multiple segments positioned to correspond with multiple attachment positions on the adhesive film. This preliminary arrangement allows the system to immediately access multiple dies without requiring intermediate repositioning actions, reducing cycle time
3Productivity
If multiple die gripper heads are added to enable parallel detachment, then the productivity increases, but the device complexity increases
Solution Approach 1:
The system employs multiple die gripper heads corresponding to different attachment positions, with each gripper head working in parallel with its associated vacuum platform segment. This segmented approach to multi-gripper configuration enables simultaneous die detachment while maintaining modular architecture that manages overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly enhances the throughput of die-ejector apparatuses by enabling simultaneous or partial simultaneous detachment of multiple dies, reducing assembly time, and improving economic efficiency by allowing for more flexible handling of variations in the die feed path.
Implementation Method 1
a vacuum platform with a variety of holes to support the adhesive film during the die removal process and to hold it in place using vacuum
Implementation Method 2
segments which are independently extendable relative to the surface of the vacuum platform to push against the adhesive film at the respective attachment position towards the die gripper
Data Source
AI summary
An apparatus 100 for releasing a die 150 with a vacuum platform 130 with two or more segments 140 is provided, which may be extended independently of the surface of the vacuum platform 130 to push against the adhesive film 110 at the respective attachment in the direction of the die gripper 170. By providing two or more segments 140 that are independently extendable, die detachment (or at least partial detachment) may be performed in parallel, and two or more dies 150 may be detached before the adhesive film 110 needs to be repositioned. Both measures may increase throughput. In addition, empty attachment positions may be omitted.