Segmented Vapor Chamber Assembly for Tight Bend Heat Spreading
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Solution Overview
Problem
Existing vapor chambers are limited in miniaturization due to planar or bent configurations with large bending radii, which restrict device compactness and can collapse when bent at smaller radii, and thermal interface materials offer insufficient thermal conductivity for modern electronic components.
Innovation Solution
A vapor chamber assembly comprising sections defined by parallel plates with a bend angle less than 180 degrees, allowing for a small bending radius without collapse, and utilizing materials with high thermal conductivity like copper, stainless steel, and titanium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a vapor chamber is bent with a large bending radius (e.g., 10 mm), then the structural stability is maintained, but the device miniaturization is restricted
Solution Approach 1:
The vapor chamber is divided into multiple planar sections that are joined together to form a bent configuration. This segmentation allows the vapor chamber to achieve sharp bends and compact shapes without requiring large bending radii, as each planar section maintains its structural integrity independently while the overall assembly achieves the desired compact form factor.
2Ease of manufacture
If thermal interface materials are used to fill empty space in housing, then the manufacturing simplicity is maintained, but the thermal conductivity is insufficient (less than 400 W/mK)
Solution Approach 1:
The invention changes the thermal conductivity parameter by replacing conventional thermal interface materials with a vapor chamber structure that achieves thermal conductivity in the range of 15000-27000 W/mK. This parameter change is achieved through the phase change mechanism inherent to vapor chambers, which dramatically improves heat transfer efficiency while maintaining manufacturing feasibility.
3Volume of moving object
If a vapor chamber is bent at a small bending radius for device miniaturization, then the device compactness is improved, but the vapor chamber collapses
Solution Approach 1:
The vapor chamber is constructed from multiple planar sections joined together, which enables sharp bends and compact configurations without the structural collapse that occurs in conventional bent vapor chambers. This segmentation approach allows the vapor chamber to achieve small bending radii suitable for device miniaturization while maintaining structural integrity.
Solution Approach 2:
The invention uses curved or bent configurations formed by joining planar sections, allowing the vapor chamber to adapt to compact device geometries. The curved paths achieved through section joining enable the vapor chamber to fit within smaller device footprints while maintaining operational reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables device miniaturization with efficient heat exchange capabilities, providing thermal conductivity up to 15000-27000 W/mK, suitable for compact electronic components without structural failure.
Implementation Method 1
Vapor chambers with thermal conductivities in the range of 15000-27000 W/mK may be possible
Implementation Method 2
a heated section (1020), two heat transmitting sections (1010, 1011), two condensing sections (1030, 1031)
Data Source
AI summary
The invention provides a vapor chamber assembly (1000) comprising two sections (1200) and one or more vapor chamber elements (100), wherein each section (1200) comprises at least part of the one or more vapor chamber elements (100), wherein each vapor chamber element (100) comprises a vapor chamber (200) at least partly defined by two parallel configured plate parts (211, 221), wherein the two sections (1200) define a bend (1100), wherein the bend (1100) has a bend angle αb, wherein 0°≤αb<180°.