Segmented Vapor Chamber Cooling for Hot Spot Dry-Burn Prevention
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Solution Overview
Problem
Current three-dimensional heat transfer devices, such as vapor chambers and heat pipes, struggle to manage heat dissipation efficiently in high-speed computing technologies, leading to functional degradation and partial dry burning.
Innovation Solution
A high heat cooling device with a heat-conducting chamber body featuring a first and second chamber divided by an isolation ring, utilizing different cooling fluids and filling rates in primary and secondary hot zones, along with strategically positioned heat pipes, to enhance heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If three-dimensional heat transfer devices are used, then heat dissipation efficiency is improved, but functional degradation and partial dry burning occur leading to performance decline
Solution Approach 1:
The first chamber is divided into a primary hot zone and a secondary hot zone by an isolation ring, creating segmented regions with different cooling fluid filling rates. This segmentation allows independent optimization of each zone's heat dissipation characteristics, preventing functional degradation while maintaining high heat dissipation efficiency.
Solution Approach 2:
Different regions of the heat-conducting chamber body are assigned different cooling fluid filling rates - the primary hot zone has a higher filling rate than the secondary hot zone. This local quality differentiation addresses varying thermal loads in different areas, preventing partial dry burning and maintaining reliability under high heat flux conditions.
2Productivity
If cooling fluid filling rate is increased in hot zones, then heat dissipation performance is improved, but risk of dry burning and functional degradation increases
Solution Approach 1:
The cooling fluid filling rate is varied as a key parameter across different zones - the primary hot zone maintains a higher filling rate for superior heat dissipation performance, while the secondary hot zone uses a lower filling rate to prevent dry burning. This parameter optimization ensures both performance and reliability are achieved simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively manages heat from multiple heating chips or local hot spots, preventing functional degradation and maintaining heat dissipation performance by optimizing fluid flow and pipe placement, ensuring efficient heat transfer across various power levels.
Implementation Method 1
The working fluid absorbs heat in the evaporation zone and vaporizes
Implementation Method 2
the vaporized working fluid rapidly flows throughout the chamber body. The heat from the vaporized working fluid is released in the condensation zone and condensed back into a liquid state
Implementation Method 3
The liquid working fluid then returns to the evaporation zone through the capillary structure
Implementation Method 4
a heat-conducting chamber body having a heat-absorbing surface
Data Source
AI summary
A high heat cooling device includes a heat-conducting chamber body that has a heat-absorbing surface, a first chamber, and a second chamber. The first chamber is closer to the heat-absorbing surface than the second chamber. At least one isolation ring is disposed in the first chamber of the heat-conducting chamber body, dividing the first chamber into a primary hot zone and a secondary hot zone. The primary hot zone is not in fluid communication with the secondary hot zone, and the primary hot zone is surrounded by the isolation ring and is in communication with the second chamber.