Segmented Vapor Chamber Heat Spreader for Multichip Thermal Crosstalk
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Solution Overview
Problem
Integrated circuit packages with multiple dies face thermal management issues due to thermal crosstalk, where high-power dies can elevate the temperature of adjacent lower-power dies, leading to performance degradation and reliability concerns.
Innovation Solution
A vapor chamber with baffles or anisotropic thermally conductive material is used to segregate heat sources and prevent thermal crosstalk by confining vapor generated from each die within separate sections, ensuring independent heat dissipation and thermal decoupling between dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple microelectronic devices are incorporated in close proximity to one another, then packaging density is improved, but thermal crosstalk increases causing temperature elevation and performance degradation
Solution Approach 1:
The heat spreader is segmented into multiple thermally isolated sections using thermally resistive material barriers. Each section corresponds to a microelectronic device and is thermally isolated from other sections, preventing thermal crosstalk while maintaining high packaging density. The barriers create distinct thermal zones that allow independent temperature control for each device.
Solution Approach 2:
Different regions of the heat spreader are given different thermal properties through the selective placement of thermally resistive material barriers. Each local region is optimized to manage heat from its corresponding device independently, with barriers positioned to block thermal pathways between high-power and sensitive devices while allowing heat removal from each device.
2Temperature
If integrated heat spreaders are used to remove heat from devices, then heat dissipation is improved, but thermal crosstalk between adjacent devices occurs
Solution Approach 1:
The heat spreader is divided into multiple thermally isolated sections using thermally resistive material barriers. Each section handles heat from a specific device independently, preventing thermal crosstalk while maintaining effective heat dissipation from all devices. The barriers create thermal boundaries that stop heat migration between adjacent device regions.
Solution Approach 2:
Thermally resistive material barriers are introduced as intermediary elements between heat-generating devices. These barriers act as thermal blockers that prevent heat from high-power devices from transferring to adjacent sensitive devices, while still allowing each device to maintain its own thermal management pathway to the heat spreader.
3Area of stationary object
If high-power dies are placed near lower-power dies, then space utilization is improved, but temperature elevation of lower-power dies occurs
Solution Approach 1:
The heat spreader is segmented into thermally isolated sections that allow high-power and low-power dies to be placed in close proximity. Thermally resistive material barriers create thermal boundaries between these sections, enabling high space utilization while preventing heat from high-power dies from elevating the temperature of adjacent low-power dies.
Solution Approach 2:
Local thermal isolation is achieved by positioning thermally resistive material barriers between high-power and low-power dies. This creates distinct thermal zones where each die type can operate at its optimal temperature range while maintaining close spatial proximity for efficient space utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces thermal crosstalk, maintaining optimal performance and reliability by allowing each die to dissipate heat independently, thus preventing temperature elevation and ensuring efficient heat transfer to a heat sink.
Implementation Method 1
a vapor chamber above the first die and the second die, the vapor chamber including a wicking material, a vapor space above the wicking material
Implementation Method 2
confining vapor generated from each die within separate sections
Implementation Method 3
ensuring independent heat dissipation and thermal decoupling between dies
Implementation Method 4
the vapor chamber including a wicking material
Data Source
AI summary
An integrated circuit package includes a first die and second die above a substrate, and a vapor chamber above at least one of the first and second die. A vapor space within the vapor chamber is separated into at least a first section and a second section. The first section may be over the first die, and the second section may be over the second die, for example. The structure separating the first and second sections at least partly restricts flow of vapor between the first and second sections, thereby preventing or reducing thermal cross talk between the first and second dies. In some cases, an anisotropic thermal material is above one of the first or second die, wherein the anisotropic thermal material has substantially higher thermal conductivity in a direction of a heat sink than a thermal conductivity in a direction of a section of the vapor chamber.