Segmented Wafer Brush Cleaning for Uniform CMP Post-Clean
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Solution Overview
Problem
Existing wafer cleaning methods, particularly after chemical mechanical polishing (CMP), cause damage to the wafer due to friction differences between rotary cylindrical brushes and circular wafers, leading to uneven cleaning.
Innovation Solution
A wafer cleaning device with multiple brush modules arranged in a line, each with a tube-shaped body and a driveshaft, allowing independent rotation and fluid supply, ensuring uniform cleaning without damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a rotary cylindrical brush is used to clean the wafer, then cleaning action is provided, but friction difference between the brush and wafer causes damage to wafer elements
Solution Approach 1:
The cleaning device is divided into multiple independent brush modules (first, second, third brush modules) arranged in a line. Each brush module can rotate independently around its own axis, allowing differential rotation speeds and directions. This segmentation eliminates the friction difference problem by enabling each module to adapt its rotation to match the wafer's circular motion at different radial positions, preventing damage to wafer elements while maintaining effective cleaning action.
2Ease of manufacture
If a rotary cylindrical brush is used to clean the wafer, then cleaning action is provided, but the cleaning is uneven across the wafer surface
Solution Approach 1:
The brush is segmented into multiple independent modules positioned at different radial locations on the wafer. Each module rotates independently, allowing the control system to adjust rotation speeds and directions according to the specific cleaning requirements at each location. This enables uniform cleaning across the entire wafer surface by compensating for variations in linear velocity and friction at different radial positions.
Solution Approach 2:
The brush modules are configured to rotate dynamically with adjustable speeds and directions. The independent rotation capability allows the system to adapt to the varying linear velocity conditions at different radial positions on the rotating wafer, ensuring consistent cleaning pressure and contact across the entire wafer surface, thereby achieving even cleaning.
3Reliability
If multiple brush modules with independent rotation are used, then even cleaning without damage is achieved, but device complexity increases
Solution Approach 1:
The cleaning device uses multiple independent brush modules, each with its own driveshaft and fluid supply pipe. While this increases the number of components, it enables precise control over each module's rotation and fluid delivery, achieving reliable damage-free and uniform cleaning. The modular design allows for systematic management of the increased complexity through standardized interfaces and control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents damage to wafer elements and achieves even cleaning of the entire wafer surface by minimizing friction and ensuring comprehensive contact with nodules.
Implementation Method 1
a first fluid supply pipe inside the first body and configured to eject a first fluid to the first body
Data Source
AI summary
A wafer cleaning device includes a plurality of brush systems arranged in a line in a first direction and configured to clean a wafer. Each of the plurality of brush systems includes a body having a tube shape extending in the first direction, a nodule arranged on an outer surface of the body, and a driveshaft extending in the first direction and configured to integrally rotate with the body. The plurality of brush systems are configured to independently rotate with the first direction as a rotation axis.