Segmented Laminated Wiring Board Structure for Higher Yield
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Solution Overview
Problem
As the size and number of interconnect layers in laminated wiring boards increase, the yield of these boards deteriorates.
Innovation Solution
A laminated wiring board configuration comprising multiple wiring boards laminated with insulating resin layers in between, mechanically and electrically connected through conductive bonding materials, such as solder, to enhance structural integrity and connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the size of the wiring board increases and the number of interconnect layers increases, then the functionality and complexity of the wiring board improve, but the yield of the wiring board deteriorates
Solution Approach 1:
The wiring board is divided into multiple separate wiring boards that are then laminated together. Instead of creating one large complex wiring board with all interconnect layers, the invention segments the structure into smaller individual wiring boards (first wiring board, second wiring boards, third wiring board) that are assembled through lamination. This segmentation reduces the complexity of manufacturing each individual component while achieving the desired functionality through combination, thereby improving yield.
Solution Approach 2:
Multiple wiring boards are nested together through lamination to form a multi-layer structure. The second wiring boards are disposed side by side and laminated on the first wiring board, and the third wiring board is laminated on the plurality of second wiring boards, creating a nested multi-layer configuration. This nesting approach allows complex functionality to be achieved by combining simpler components, improving manufacturing yield.
2Reliability
If multiple wiring boards are laminated together to increase interconnect layers, then the electrical connectivity improves, but the mechanical defects and manufacturing complexity increase
Solution Approach 1:
The manufacturing process is segmented into separate steps for creating individual wiring boards and then assembling them through lamination. Each wiring board can be manufactured independently with fewer interconnect layers, reducing the complexity of each manufacturing step while achieving high electrical connectivity through the lamination assembly process.
Solution Approach 2:
Individual wiring boards are prepared in advance with their respective interconnect layers and patterns before lamination. The conductive bonding materials are applied to the wiring boards prior to assembly, allowing preliminary preparation and quality control of each component separately, which simplifies the overall manufacturing process while ensuring reliable electrical connectivity.
3Reliability
If conductive bonding materials are used to laminate wiring boards, then the electrical connectivity improves, but the manufacturing defects may increase
Solution Approach 1:
The patent applies conductive bonding materials at specific locations where electrical connectivity is required, rather than uniformly across all surfaces. The bonding materials are applied to connect specific interconnect layers between adjacent wiring boards, providing sufficient electrical connectivity only where needed. This partial application approach reduces the risk of manufacturing defects while maintaining necessary electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed configuration improves yield by ensuring robust mechanical and electrical connections, reducing defects and enhancing the overall performance of large laminated wiring boards.
Implementation Method 1
a first insulating resin layer disposed between the first wiring board and the plurality of second wiring boards; and a second insulating resin layer disposed between the plurality of second wiring boards and the third wiring board
Implementation Method 2
mechanically and electrically connected through conductive bonding materials, such as solder
Data Source
AI summary
A laminated wiring board includes a first wiring board, a plurality of second wiring boards disposed side by side and laminated on the first wiring board, a third wiring board laminated on the plurality of second wiring boards, a first insulating resin layer disposed between the first wiring board and the plurality of second wiring boards, and a second insulating resin layer disposed between the plurality of second wiring boards and the third wiring board.