Segmented Wiring Parts for Pre-Mounting Electrical Testing
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Solution Overview
Problem
Conventional electronic component packaging methods require electrical testing after mounting, leading to significant losses when faults are detected, as the entire wiring layer becomes unusable, especially with the increasing demand for smaller components with multiple pins.
Innovation Solution
An electronic component package design that includes first and second wiring parts with insulating layers, conductive patterns, and a frame with conductive via connections, allowing for pre-mounting electrical testing to identify and address faults before component integration, thereby reducing waste and improving manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical testing is performed after mounting electronic components, then the package can be tested for functionality, but significant losses occur when faults are detected in wiring parts, as the entire wiring layer becomes unusable
Solution Approach 1:
The wiring layer is divided into multiple independent wiring parts (first wiring part, second wiring part, third wiring part) that can be tested and replaced independently. When a fault is detected in one wiring part, only that specific part needs to be replaced rather than the entire wiring layer, significantly reducing material waste.
Solution Approach 2:
Electrical testing is performed on the wiring parts before mounting the electronic component. This preliminary testing identifies faulty wiring parts in advance, allowing them to be replaced before the expensive electronic component is mounted, thereby preventing loss of both the wiring layer and the electronic component.
2Volume of moving object
If the size of electronic components is reduced, then the demand for smaller components is satisfied, but implementing multiple pins in small components becomes more difficult
Solution Approach 1:
The patent transitions from planar wiring to three-dimensional wiring structures by stacking multiple wiring parts vertically. This allows multiple pins to be implemented in a compact space by utilizing the vertical dimension, enabling small components to have multiple connection points without increasing their footprint area.
Solution Approach 2:
Multiple wiring parts are nested vertically within each other, with each wiring part containing conductive patterns and vias that connect to adjacent wiring parts. This nested arrangement allows multiple pins to be packed into a small component footprint by utilizing vertical stacking rather than horizontal expansion.
3Area of stationary object
If multiple electronic components are integrated into a compact package, then space efficiency is improved, but the complexity of the packaging structure increases
Solution Approach 1:
The packaging structure is segmented into multiple independent wiring parts that can be manufactured and tested separately before assembly. This segmentation simplifies the manufacturing process by allowing modular production and reduces the complexity of debugging and repair, even though the final structure is compact and multi-layered.
Solution Approach 2:
The patent utilizes vertical stacking of multiple wiring parts to achieve compact packaging. By transitioning from two-dimensional planar wiring to three-dimensional stacked wiring, the package area is reduced while the internal structure remains manageable through standardized vertical interconnections via vias.
Data Source
AI summary
An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.